AMD Xilinx
XC3030-70TQ100C
XC3030-70TQ100C ECAD Model
XC3030-70TQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP100,.63SQ,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3030-70TQ100C Datasheet Download
XC3030-70TQ100C Overview
The XC3030-70TQ100C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is an important component for the development of modern computing systems and requires the use of HDL language.
The XC3030-70TQ100C chip model is an example of the latest technologies in the industry. It is designed to meet the needs of high-performance applications and is capable of handling complex tasks. The chip model is a versatile tool that can be used in a variety of applications such as embedded systems, digital signal processing, and image processing.
In terms of industry trends, the XC3030-70TQ100C chip model is expected to continue to be a popular choice for high-performance applications. The chip model is capable of handling complex tasks, and its use of HDL language makes it a powerful tool for developing modern computing systems. As the technology advances, the chip model is likely to become more widely used in the future.
The XC3030-70TQ100C chip model can be used to develop and popularize future intelligent robots. This chip model has the capability to handle complex tasks and is capable of providing the necessary computing power for the development of robots. To effectively use the chip model, technical talents such as engineers, software developers, and data scientists are needed.
In conclusion, the XC3030-70TQ100C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. The chip model is expected to continue to be a popular choice for high-performance applications in the future, and it can be used to develop and popularize future intelligent robots. Technical talents such as engineers, software developers, and data scientists are needed to effectively use the chip model.
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5,041 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7.5933 | $7.5933 |
| 10+ | $7.5116 | $75.1162 |
| 100+ | $7.1034 | $710.3376 |
| 1000+ | $6.6951 | $3,347.5680 |
| 10000+ | $6.1236 | $6,123.6000 |
| The price is for reference only, please refer to the actual quotation! | ||