AMD Xilinx
XC3030-70PG84M
XC3030-70PG84M ECAD Model
XC3030-70PG84M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P84 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 84 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA84M,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.94 mm | |
| Length | 27.94 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA84M,11X11 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3030-70PG84M Datasheet Download
XC3030-70PG84M Overview
The XC3030-70PG84M chip model is a high-performance digital signal processor, embedded processor, and image processor. It is designed to meet the needs of modern digital signal processing, embedded processing, and image processing applications. The XC3030-70PG84M chip model is designed to be used with the HDL language, which is an industry-standard language for digital signal processing and embedded processing applications.
The XC3030-70PG84M chip model is designed to be future-proof and upgradable. It is designed with the latest technologies in mind, allowing it to be used in advanced communication systems. The chip model is designed to be flexible and adaptable, allowing it to be used in a variety of applications and environments.
The industry trends of the XC3030-70PG84M chip model will continue to evolve as new technologies become available. In order to keep up with the ever-changing industry trends, the XC3030-70PG84M chip model must be able to be upgraded and adapted to the latest technologies. This will ensure that the chip model is able to keep up with the ever-changing industry trends and remain competitive.
The original design intention of the XC3030-70PG84M chip model was to provide a high-performance, flexible, and upgradable platform for digital signal processing, embedded processing, and image processing applications. The chip model was designed to be flexible and upgradable, allowing it to be used in a variety of applications and environments. This allows the chip model to remain competitive and up-to-date with the latest technologies.
The XC3030-70PG84M chip model is designed to be future-proof and upgradable. It is designed with the latest technologies in mind, allowing it to be used in advanced communication systems. The chip model is also designed to be flexible and adaptable, allowing it to be used in a variety of applications and environments. This allows the chip model to remain competitive and up-to-date with the latest technologies.
The XC3030-70PG84M chip model is designed to meet the needs of modern digital signal processing, embedded processing, and image processing applications. It is designed to be future-proof and upgradable, allowing it to remain competitive and up-to-date with the latest technologies. The chip model is also designed to be flexible and adaptable, allowing it to be used in a variety of applications and environments. This allows the chip model to remain competitive and up-to-date with the latest technologies, while providing users with a high-performance and reliable platform for their digital signal processing, embedded processing, and image processing needs.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||