AMD Xilinx
XC3030-70PG84I
XC3030-70PG84I ECAD Model
XC3030-70PG84I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P84 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 84 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA84M,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.94 mm | |
| Length | 27.94 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA84M,11X11 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3030-70PG84I Datasheet Download
XC3030-70PG84I Overview
The XC3030-70PG84I chip model is an advanced integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is a highly versatile and powerful IC, and it requires the use of HDL (Hardware Description Language) for programming and development.
The chip model XC3030-70PG84I is highly sought after in the industry for its high performance and reliability. It is a reliable and cost-effective solution for a wide range of applications, from consumer electronics to industrial automation.
The original design intention of the chip model XC3030-70PG84I is to provide a comprehensive and powerful solution for digital signal processing, embedded processing, and image processing. It is designed to provide a flexible platform for developers to create applications with high performance and reliability. It is also designed to be upgradable and future-proof, so it can be used in advanced communication systems.
The industry trends of the chip model XC3030-70PG84I and the future development of related industries depend on what specific technologies are needed. The chip model XC3030-70PG84I is designed to be versatile and powerful, and it can be used in a wide range of applications. It is expected to be used in more advanced applications in the future, such as 5G communication systems and artificial intelligence (AI) applications.
In conclusion, the chip model XC3030-70PG84I is a powerful and reliable IC designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be upgradable and future-proof, so it can be used in advanced communication systems. The industry trends of the chip model XC3030-70PG84I and the future development of related industries depend on what specific technologies are needed. It is expected to be used in more advanced applications in the future, such as 5G communication systems and AI applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||