AMD Xilinx
XC3030-70PC84I
XC3030-70PC84I ECAD Model
XC3030-70PC84I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC84,1.2SQ | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3030-70PC84I Datasheet Download
XC3030-70PC84I Overview
The chip model XC3030-70PC84I is a new and innovative product that has made its way into the market. It has been designed to meet the needs of the ever-evolving technology industry, offering a wide range of features and capabilities. This chip model has become increasingly popular due to its ability to provide a cost-effective solution for a wide range of applications.
As the industry trends shift, it is important to understand how the chip model XC3030-70PC84I can continue to remain relevant. It is important to understand the original design intention of the chip model and the possibilities for future upgrades. This chip model can be used in a variety of applications, including advanced communication systems, and can be used to develop and popularize future intelligent robots.
The application environment of the chip model XC3030-70PC84I is ever-changing, and it is important to understand what specific technologies are needed to use the model effectively. This chip model is designed to be flexible and can be used with a variety of technologies, including the latest wireless communication technologies. It is important to understand what type of technical expertise is needed to use the chip model effectively and to ensure that the application environment is compatible with the chip model.
In order to ensure that the chip model XC3030-70PC84I remains relevant, it is important to stay up to date with the latest industry trends and to understand the possibilities for future upgrades. It is also important to understand the technical expertise needed to use the chip model effectively, and to ensure that the application environment is compatible with the chip model. By understanding the original design intention of the chip model and the possibilities for future upgrades, it is possible to ensure that the model remains relevant and can be used to develop and popularize future intelligent robots.
You May Also Be Interested In
4,149 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||