AMD Xilinx
XC3030-70PC68C
XC3030-70PC68C ECAD Model
XC3030-70PC68C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 4.445 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC68,1.0SQ | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3030-70PC68C Datasheet Download
XC3030-70PC68C Overview
The XC3030-70PC68C chip model is a high-performance digital signal processing (DSP) solution for embedded systems and image processing applications. It is designed to provide enhanced performance and flexibility for advanced communication systems. It is built on an FPGA platform and requires the use of HDL language for programming.
The original design intention of the XC3030-70PC68C chip model was to provide a high-performance, low-power solution for embedded systems and image processing applications. It is designed with a high degree of scalability and flexibility, allowing users to upgrade their systems as new technologies become available. The chip model is capable of processing large amounts of data, making it ideal for high-performance applications.
The product description of the XC3030-70PC68C chip model includes a range of features that make it suitable for a variety of applications. It has a high-speed, low-power architecture that is designed to support the latest communication protocols. It also features a wide range of I/O options, including Ethernet, USB, and Serial interfaces. The chip model also supports a variety of memory configurations, allowing users to tailor their systems to their specific needs.
When designing systems using the XC3030-70PC68C chip model, it is important to consider the specific requirements of the application. It is important to ensure that the system is designed to meet the specific requirements of the application, as well as the performance and power requirements of the chip model. Additionally, it is important to consider any potential upgrades that may be required in the future.
To ensure successful implementation of the XC3030-70PC68C chip model, it is important to consider case studies and best practices. This can help to ensure that the system is designed with the appropriate components and configuration, and that the system is optimized for the specific application. Additionally, it is important to consider any potential risks associated with the system, such as power or signal integrity issues.
In conclusion, the XC3030-70PC68C chip model is an excellent choice for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to provide enhanced performance and flexibility for advanced communication systems. When designing systems using the chip model, it is important to consider the specific requirements of the application, as well as any potential upgrades or risks associated with the system. Additionally, it is important to consider case studies and best practices to ensure successful implementation of the chip model.
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1,968 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4.4640 | $4.4640 |
| 10+ | $4.4160 | $44.1600 |
| 100+ | $4.1760 | $417.6000 |
| 1000+ | $3.9360 | $1,968.0000 |
| 10000+ | $3.6000 | $3,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||