
AMD Xilinx
XC3030-70PC44I
XC3030-70PC44I ECAD Model
XC3030-70PC44I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 34 | |
Number of Outputs | 34 | |
Number of Logic Cells | 100 | |
Number of Equivalent Gates | 1500 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 100 CLBS, 1500 GATES | |
Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQCC-J44 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 44 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC44,.7SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 16.5862 mm | |
Length | 16.5862 mm | |
Seated Height-Max | 4.318 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | QCCJ, LDCC44,.7SQ | |
Pin Count | 44 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3030-70PC44I Datasheet Download
XC3030-70PC44I Overview
The XC3030-70PC44I chip model is a cutting-edge technological advancement in the world of integrated circuits. This chip model is designed to provide high-performance computing power, with a focus on low-power consumption and high-speed data transfer. It is tailored for use in a wide range of applications, such as networks, intelligent systems, and other smart devices.
The XC3030-70PC44I chip model is based on the latest advances in semiconductor technology, allowing it to offer a variety of features that make it a desirable choice for many industries. It is capable of providing high-speed data transfer, with low-power consumption and a low-cost design. Additionally, the chip model is designed to be compatible with a variety of operating systems and applications.
The XC3030-70PC44I chip model is expected to be in high demand in the near future due to its ability to provide high-speed data transfer and low-power consumption. This chip model is ideal for use in networks, intelligent systems, and other smart devices. It is capable of providing high-speed data transfer, with low-power consumption and a low-cost design. Additionally, the chip model is designed to be compatible with a variety of operating systems and applications.
The XC3030-70PC44I chip model is designed with specific requirements in mind. It is designed to be capable of providing high-speed data transfer, with low-power consumption and a low-cost design. Additionally, the chip model is designed to be compatible with a variety of operating systems and applications. The chip model is also designed to be able to handle a variety of data types, including audio, video, and text.
The XC3030-70PC44I chip model has already been used in a variety of applications, such as networking and intelligent systems. In addition, the chip model has been used in a variety of case studies, such as in the development of autonomous vehicles. This chip model is also capable of being used in the era of fully intelligent systems, as it is capable of handling a variety of data types, including audio, video, and text.
When using the XC3030-70PC44I chip model, there are a few precautions to keep in mind. First, it is important to ensure that the chip model is compatible with the operating system and application that it is being used with. Additionally, it is important to ensure that the chip model is properly powered and cooled, as this can affect its performance. Finally, it is important to ensure that the chip model is properly configured for the specific application that it is being used with.
Overall, the XC3030-70PC44I chip model is a cutting-edge technological advancement in the world of integrated circuits. It is capable of providing high-speed data transfer, with low-power consumption and a low-cost design. Additionally, the chip model is designed to be compatible with a variety of operating systems and applications. The chip model is expected to be in high demand in the near future due to its ability to provide high-speed data transfer and low-power consumption, and it is capable of being used in the era of fully intelligent systems. When using this chip model, it is important to ensure that it is properly powered and cooled, as well as properly configured for the specific application that it is being used with.
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1,220 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11.9040 | $11.9040 |
10+ | $11.7760 | $117.7600 |
100+ | $11.1360 | $1,113.6000 |
1000+ | $10.4960 | $5,248.0000 |
10000+ | $9.6000 | $9,600.0000 |
The price is for reference only, please refer to the actual quotation! |