AMD Xilinx
XC3030-125PQ100C
XC3030-125PQ100C ECAD Model
XC3030-125PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 5.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 2.87 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3030-125PQ100C Datasheet Download
XC3030-125PQ100C Overview
The chip model XC3030-125PQ100C is a high-performance and powerful chip, which is suitable for high-performance digital signal processing, embedded processing, image processing, etc. It requires the use of HDL language and can be widely used in many industries.
In terms of industry trends, the development of XC3030-125PQ100C chip is mainly driven by the demand of the market and the development of new technologies. With the rapid development of artificial intelligence and the increasing demand for intelligent robots, the application environment of XC3030-125PQ100C chip will also need to be supported by new technologies.
As for the application of XC3030-125PQ100C chip in the development and popularization of future intelligent robots, it is possible. This chip has the characteristics of high performance and low power consumption, which can meet the needs of intelligent robots in terms of computing power. At the same time, its use of HDL language also makes it easier for developers to use.
In order to use XC3030-125PQ100C chip effectively, technical talents with a certain level of knowledge and skills are required. They need to have a certain understanding of HDL language, as well as knowledge and experience in digital signal processing, embedded processing, image processing, etc. With these talents, XC3030-125PQ100C chip can be used to its full potential.
You May Also Be Interested In
3,985 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4.4640 | $4.4640 |
| 10+ | $4.4160 | $44.1600 |
| 100+ | $4.1760 | $417.6000 |
| 1000+ | $3.9360 | $1,968.0000 |
| 10000+ | $3.6000 | $3,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||