
AMD Xilinx
XC3030-125PC44C
XC3030-125PC44C ECAD Model
XC3030-125PC44C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 34 | |
Number of Outputs | 34 | |
Number of Logic Cells | 100 | |
Number of Equivalent Gates | 1500 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 5.5 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 100 CLBS, 1500 GATES | |
Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
Clock Frequency-Max | 125 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQCC-J44 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 44 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC44,.7SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 16.5862 mm | |
Length | 16.5862 mm | |
Seated Height-Max | 4.318 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | QCCJ, LDCC44,.7SQ | |
Pin Count | 44 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3030-125PC44C Datasheet Download
XC3030-125PC44C Overview
The XC3030-125PC44C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to describe the behavior of digital systems. This chip model is capable of providing high-speed data processing, making it ideal for applications such as networking and intelligent scenarios.
The XC3030-125PC44C chip model is designed to provide a wide range of features and capabilities. It is equipped with a 32-bit RISC processor, a high-speed memory controller, and a high-performance digital signal processor. This chip model also has a wide range of I/O ports and peripherals, making it suitable for a variety of applications. It also has a high-speed clock generator and an on-chip debug system, making it easy to debug and develop applications for this chip model.
In terms of its applications, the XC3030-125PC44C chip model is suitable for a wide range of network and intelligent scenarios. It can be used for high-speed data processing and communication, making it ideal for applications such as wireless networks, intelligent control systems, and automated systems. This chip model is also suitable for applications in the era of fully intelligent systems, such as autonomous vehicles, robotics, and smart homes.
When designing applications for the XC3030-125PC44C chip model, it is important to consider the specific design requirements of the chip model. For example, the chip model has a limited amount of memory and a limited number of I/O ports, so it is important to ensure that the design of the application is optimized to make the most of the available resources. It is also important to consider the power consumption of the chip model and the impact of the application on the power consumption of the system.
There are a number of case studies and examples of applications that have been designed using the XC3030-125PC44C chip model. For example, one application designed using this chip model is a wireless sensor network for monitoring air quality. This application uses the chip model to collect and process data from the sensors in the network, and then transmit the data to a central server for further analysis.
When designing applications for the XC3030-125PC44C chip model, it is important to consider the specific design requirements of the chip model, as well as the power consumption of the chip model and the impact of the application on the power consumption of the system. It is also important to consider the possible future applications of the chip model in networks and intelligent scenarios, as well as whether it is possible to be used in the era of fully intelligent systems. By considering these factors, it is possible to design applications that are optimized for the XC3030-125PC44C chip model and make the most of its capabilities.
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