AMD Xilinx
XC3030-100TQ100C
XC3030-100TQ100C ECAD Model
XC3030-100TQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP100,.63SQ,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3030-100TQ100C Datasheet Download
XC3030-100TQ100C Overview
The chip model XC3030-100TQ100C is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is a powerful solution for these applications and requires the use of HDL language for programming.
In the current market, the chip model XC3030-100TQ100C has seen a surge in popularity due to its ability to meet the demands of high-performance applications. It is being used in a wide range of industries, such as telecommunications, automotive, medical, and industrial automation.
In terms of future trends and development, the chip model XC3030-100TQ100C is expected to continue to be used in a variety of applications. It is likely that new technologies will be needed to support the application environment. These could include technologies such as artificial intelligence, machine learning, and natural language processing.
The chip model XC3030-100TQ100C is also likely to be used in networks, as well as in intelligent scenarios. It is possible that it could be used in the era of fully intelligent systems, such as autonomous vehicles and smart homes. This would require the use of advanced technologies, such as deep learning, computer vision, and natural language processing.
Overall, the chip model XC3030-100TQ100C is a powerful solution for a variety of applications. Its ability to support the application environment with new technologies makes it a valuable asset for both current and future applications. As the need for intelligent systems grows, the chip model XC3030-100TQ100C is likely to remain a popular choice for many industries.
You May Also Be Interested In
1,358 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11.1349 | $11.1349 |
| 10+ | $11.0152 | $110.1516 |
| 100+ | $10.4165 | $1,041.6510 |
| 1000+ | $9.8179 | $4,908.9300 |
| 10000+ | $8.9798 | $8,979.7500 |
| The price is for reference only, please refer to the actual quotation! | ||