AMD Xilinx
XC3030-100PQ100I
XC3030-100PQ100I ECAD Model
XC3030-100PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 2.87 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP, QFP100,.7X.9 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 100 |
XC3030-100PQ100I Datasheet Download
XC3030-100PQ100I Overview
The XC3030-100PQ100I chip model is a powerful tool for the development of future intelligent systems. Developed by the leading semiconductor company Xilinx, this model is designed to provide a high-performance, low-power solution for a wide range of applications. It is equipped with the latest technologies, such as a multi-core processor, a large memory, and a high-speed bus, which makes it suitable for many different types of applications.
The XC3030-100PQ100I chip model offers a number of advantages for the development of intelligent systems. It has a high-speed processor, which allows for faster processing of data. It also has a large memory, which allows for more efficient storage of data. It also has a high-speed bus, which enables faster data transfer between components. Additionally, it is designed to be energy efficient, which reduces the cost of running an intelligent system.
The expected demand for the XC3030-100PQ100I chip model in related industries is expected to continue to increase in the future. This is due to the increasing demand for intelligent systems in various industries, such as automotive, healthcare, and consumer electronics. The chip model is expected to be used in a variety of applications, such as network infrastructure, machine learning, and artificial intelligence.
The XC3030-100PQ100I chip model can be used in a variety of intelligent scenarios. It can be used for the development of intelligent networks, such as 5G networks, as well as for the development of intelligent robots. It can also be used for the development of autonomous vehicles, as well as for the development of intelligent home appliances. Additionally, it can be used for the development of intelligent robots, such as service robots and industrial robots.
The XC3030-100PQ100I chip model can be used in the era of fully intelligent systems. It is capable of providing the necessary processing power and memory to support the development of complex intelligent systems. Additionally, it is designed to be energy efficient, which reduces the cost of running an intelligent system.
In order to use the XC3030-100PQ100I chip model effectively, technical talents are needed. These include software engineers, hardware engineers, and artificial intelligence experts. Software engineers are needed to develop the software for the chip model. Hardware engineers are needed to design and build the hardware for the chip model. Finally, artificial intelligence experts are needed to develop the algorithms and models needed to make the chip model work.
In conclusion, the XC3030-100PQ100I chip model is a powerful tool for the development of future intelligent systems. It offers a number of advantages, such as a high-speed processor, a large memory, and a high-speed bus. It can be used in a variety of intelligent scenarios, such as networks, robots, and autonomous vehicles. Additionally, it can be used in the era of fully intelligent systems. To use the XC3030-100PQ100I chip model effectively, technical talents are needed, such as software engineers, hardware engineers, and artificial intelligence experts.
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3,409 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11.1349 | $11.1349 |
| 10+ | $11.0152 | $110.1516 |
| 100+ | $10.4165 | $1,041.6510 |
| 1000+ | $9.8179 | $4,908.9300 |
| 10000+ | $8.9798 | $8,979.7500 |
| The price is for reference only, please refer to the actual quotation! | ||