AMD Xilinx
XC3030-100PG84I
XC3030-100PG84I ECAD Model
XC3030-100PG84I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P84 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 84 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA84M,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.94 mm | |
| Length | 27.94 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA84M,11X11 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3030-100PG84I Datasheet Download
XC3030-100PG84I Overview
The XC3030-100PG84I chip model has become increasingly popular in the electronics industry due to its numerous advantages. This chip model is a highly integrated chip with a wide range of features, including high-speed data processing, high-speed communication, and low power consumption. It is also capable of supporting multiple protocols and interfaces, making it suitable for a variety of applications.
The design intention of the XC3030-100PG84I chip model is to provide a powerful, low-power, and cost-effective solution for a wide range of applications. It is expected to be in high demand in the future due to its ability to be used in a variety of industries, including medical, industrial, automotive, and consumer electronics. In addition, the chip model is also expected to be upgraded to meet the needs of the ever-evolving industry, making it even more useful for a variety of applications.
The XC3030-100PG84I chip model is expected to be used in networks and intelligent scenarios in the future. It is likely to be used in advanced communication systems, such as 5G networks, as well as in autonomous systems, such as robots and drones. In addition, the chip model is also expected to be used in the era of fully intelligent systems, such as the Internet of Things (IoT). This chip model is expected to be the foundation of the future of intelligent systems and networks, as it is capable of providing the necessary processing power and data transmission capabilities to enable these systems.
In conclusion, the XC3030-100PG84I chip model is a powerful and cost-effective solution for a wide range of applications. It is expected to be in high demand in the future due to its ability to be used in a variety of industries, as well as its potential for upgrades. Furthermore, it is also expected to be used in networks and intelligent scenarios in the future, making it a valuable asset for the future of intelligent systems and networks.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||