XC3020A-2PQ100C
XC3020A-2PQ100C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3020A-2PQ100C


XC3020A-2PQ100C
F20-XC3020A-2PQ100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP, QFP100,.7X.9
QFP, QFP100,.7X.9

XC3020A-2PQ100C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3020A-2PQ100C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 64
Number of Outputs 64
Number of Logic Cells 64
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape RECTANGULAR
Technology CMOS
Clock Frequency-Max 325 MHz
Power Supplies 5 V
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING
Terminal Pitch 635 µm
Terminal Position QUAD
Ihs Manufacturer XILINX INC
Package Description QFP, QFP100,.7X.9
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3020A-2PQ100C Datasheet Download


XC3020A-2PQ100C Overview



The XC3020A-2PQ100C chip model is an advanced integrated circuit (IC) designed to meet the highest standards of performance and reliability. Developed by Xilinx, one of the leading semiconductor companies in the world, the chip model is an important component in the development of modern communication systems.


The XC3020A-2PQ100C chip model was designed with a particular purpose in mind: to provide a high-performance, low-power solution for communication systems. It is capable of handling a wide range of applications, including wireless, wired, and optical communication networks. The chip model is also equipped with a rich set of features, such as a high-speed data transfer rate, low power consumption, and a wide range of communication protocols.


The XC3020A-2PQ100C chip model is designed to be highly reliable and robust, making it suitable for use in advanced communication systems. It is also capable of handling a wide range of network topologies, including mesh, star, and hybrid networks. Moreover, the chip model is capable of supporting the latest communication protocols, including Ethernet, Wi-Fi, and Bluetooth.


The XC3020A-2PQ100C chip model is also suitable for use in the era of fully intelligent systems, such as the Internet of Things (IoT). With its powerful processing capabilities, the chip model is capable of handling complex tasks, such as machine learning and artificial intelligence. It can also be used in various intelligent scenarios, such as autonomous vehicles, smart homes, and smart factories.


The product description of the XC3020A-2PQ100C chip model includes its physical dimensions, operating temperature range, and power consumption. It is also important to note that the chip model is designed to be compatible with a variety of operating systems, such as Windows, Linux, and Mac OS.


Case studies have shown that the XC3020A-2PQ100C chip model is a reliable and robust solution for communication systems. It is capable of handling a wide range of applications, including wireless, wired, and optical communication networks. Moreover, the chip model is suitable for use in the era of fully intelligent systems, such as the Internet of Things (IoT).


When using the XC3020A-2PQ100C chip model, it is important to take certain precautions. For instance, the chip model should not be used in environments with high levels of electromagnetic interference, as this could interfere with its performance. Additionally, the chip model should not be exposed to extreme temperatures, as this could damage the chip.


In conclusion, the XC3020A-2PQ100C chip model is a reliable and robust solution for communication systems. It is capable of handling a wide range of applications, including wireless, wired, and optical communication networks. Moreover, the chip model is suitable for use in the era of fully intelligent systems, such as the Internet of Things (IoT). With its powerful processing capabilities, the chip model is capable of handling complex tasks, such as machine learning and artificial intelligence. Finally, it is important to take certain precautions when using the chip model, such as avoiding high levels of electromagnetic interference and extreme temperatures.



3,087 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote