AMD Xilinx
XC3020-70PQ100I
XC3020-70PQ100I ECAD Model
XC3020-70PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 2.87 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3020-70PQ100I Datasheet Download
XC3020-70PQ100I Overview
The Xilinx XC3020-70PQ100I chip model is a programmable logic device that offers a wide range of features and capabilities. It is designed to be used in a variety of applications, ranging from basic logic designs to complex system designs. The chip model offers a wide range of possibilities for future upgrades, making it a great choice for those looking to stay ahead of the technological curve.
The XC3020-70PQ100I chip model is ideal for advanced communication systems. It has the ability to process large amounts of data quickly and accurately, making it a great choice for networks that need high performance. It can be used in a variety of scenarios, including wireless communication, optical communication, and satellite communication. Additionally, the chip model is capable of supporting a variety of protocols, such as Ethernet, Wi-Fi, and Bluetooth.
The XC3020-70PQ100I chip model is also a great choice for the development and popularization of future intelligent robots. It has the capability to process a wide range of data, making it ideal for robots that need to make decisions quickly and accurately. Additionally, the chip model is capable of supporting a variety of sensors, allowing robots to accurately perceive their environment. To use the chip model effectively, it is important to have the right technical skills. Knowledge of programming languages such as C and Verilog is essential for getting the most out of the chip model. Additionally, knowledge of robotics and artificial intelligence will be helpful in making the most of the chip model’s capabilities.
Overall, the XC3020-70PQ100I chip model is a great choice for those looking to stay ahead of the technological curve. It offers a wide range of features and capabilities, making it ideal for advanced communication systems, intelligent robots, and more. With the right technical skills, the chip model can be used to its full potential, allowing users to stay ahead of the curve and make the most of the chip model’s capabilities.
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