
AMD Xilinx
XC3020-70PQ100C
XC3020-70PQ100C ECAD Model
XC3020-70PQ100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 64 | |
Number of Outputs | 64 | |
Number of Logic Cells | 64 | |
Number of Equivalent Gates | 1000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 64 CLBS, 1000 GATES | |
Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP100,.7X.9 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 2.87 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, QFP100,.7X.9 | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3020-70PQ100C Datasheet Download
XC3020-70PQ100C Overview
The chip model XC3020-70PQ100C has become an increasingly popular choice for many industries due to its high performance and low power consumption. It has been widely used in a variety of applications, such as communication networks, consumer electronics, industrial automation, and automotive control. With the development of technology and the growing demand for more powerful and efficient solutions, the XC3020-70PQ100C chip model is expected to become even more popular in the near future.
The XC3020-70PQ100C chip model offers a wide range of features, including support for high-speed data transfer, low-power operation, and a high level of integration. It is also designed to be compatible with a variety of communication protocols and can be used in a variety of applications. These features make the XC3020-70PQ100C chip model an ideal choice for many industries.
In terms of future applications, the XC3020-70PQ100C chip model could be used in the development of intelligent networks and systems. This could include the use of the chip in the development of advanced artificial intelligence (AI) systems, as well as in the development of autonomous vehicles, smart homes, and other intelligent scenarios. The chip model could also be used in the development of more efficient communication networks and systems, as well as in the development of more powerful and efficient solutions for industry.
The XC3020-70PQ100C chip model is also expected to be used in the development of the next generation of fully intelligent systems. This could include the development of systems that are capable of learning and adapting to their environment, as well as systems that are able to interact with humans in a natural way. The chip model could also be used in the development of systems that are able to process large amounts of data quickly and accurately.
Overall, the XC3020-70PQ100C chip model is an ideal choice for many industries due to its high performance and low power consumption. It is expected to become even more popular in the near future due to its wide range of features and its ability to be used in a variety of applications. The chip model is also expected to be used in the development of next-generation intelligent systems and networks, as well as in the development of more efficient and powerful solutions for industry.
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