XC3020-70PQ100C
XC3020-70PQ100C
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rohs

AMD Xilinx

XC3020-70PQ100C


XC3020-70PQ100C
F20-XC3020-70PQ100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP, QFP100,.7X.9
QFP, QFP100,.7X.9

XC3020-70PQ100C ECAD Model


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XC3020-70PQ100C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 64
Number of Outputs 64
Number of Logic Cells 64
Number of Equivalent Gates 1000
Number of CLBs 64
Combinatorial Delay of a CLB-Max 9 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape RECTANGULAR
Technology CMOS
Organization 64 CLBS, 1000 GATES
Additional Feature 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA
Clock Frequency-Max 70 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 14 mm
Length 20 mm
Seated Height-Max 2.87 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP, QFP100,.7X.9
Pin Count 100
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3020-70PQ100C Datasheet Download


XC3020-70PQ100C Overview



The chip model XC3020-70PQ100C has become an increasingly popular choice for many industries due to its high performance and low power consumption. It has been widely used in a variety of applications, such as communication networks, consumer electronics, industrial automation, and automotive control. With the development of technology and the growing demand for more powerful and efficient solutions, the XC3020-70PQ100C chip model is expected to become even more popular in the near future.


The XC3020-70PQ100C chip model offers a wide range of features, including support for high-speed data transfer, low-power operation, and a high level of integration. It is also designed to be compatible with a variety of communication protocols and can be used in a variety of applications. These features make the XC3020-70PQ100C chip model an ideal choice for many industries.


In terms of future applications, the XC3020-70PQ100C chip model could be used in the development of intelligent networks and systems. This could include the use of the chip in the development of advanced artificial intelligence (AI) systems, as well as in the development of autonomous vehicles, smart homes, and other intelligent scenarios. The chip model could also be used in the development of more efficient communication networks and systems, as well as in the development of more powerful and efficient solutions for industry.


The XC3020-70PQ100C chip model is also expected to be used in the development of the next generation of fully intelligent systems. This could include the development of systems that are capable of learning and adapting to their environment, as well as systems that are able to interact with humans in a natural way. The chip model could also be used in the development of systems that are able to process large amounts of data quickly and accurately.


Overall, the XC3020-70PQ100C chip model is an ideal choice for many industries due to its high performance and low power consumption. It is expected to become even more popular in the near future due to its wide range of features and its ability to be used in a variety of applications. The chip model is also expected to be used in the development of next-generation intelligent systems and networks, as well as in the development of more efficient and powerful solutions for industry.



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