AMD Xilinx
XC3020-70PG84B
XC3020-70PG84B ECAD Model
XC3020-70PG84B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P84 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 84 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA84M,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.94 mm | |
| Length | 27.94 mm | |
| Seated Height-Max | 5.207 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA84M,11X11 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3020-70PG84B Datasheet Download
XC3020-70PG84B Overview
The XC3020-70PG84B chip model is a powerful, versatile and reliable chip model for high-performance digital signal processing, embedded processing and image processing. It is an ideal choice for applications in a wide range of industries, from consumer electronics to medical equipment.
The XC3020-70PG84B chip model is designed to be programmed in HDL (Hardware Description Language) and offers a range of features and capabilities to meet the needs of a wide range of applications. It is designed to deliver high performance and low power consumption, making it an ideal choice for applications that require high performance with low power consumption.
The XC3020-70PG84B chip model is also designed to be flexible and programmable, allowing for custom solutions to meet the needs of specific applications. This chip model also offers a range of features that can be used to support new technologies such as artificial intelligence (AI) and machine learning (ML). This makes it an ideal choice for applications that require the support of new technologies.
As the demand for high-performance digital signal processing, embedded processing and image processing increases, the XC3020-70PG84B chip model is expected to be in high demand in the future. Its flexibility, reliability and performance make it an ideal choice for a wide range of applications. Its low power consumption also makes it an attractive option for applications that require low power consumption.
Overall, the XC3020-70PG84B chip model is an ideal choice for a wide range of applications. It is designed to be flexible, reliable and powerful, and offers a range of features and capabilities to meet the needs of a wide range of applications. Its low power consumption and ability to support new technologies make it an attractive option for applications that require low power consumption and support for new technologies. The XC3020-70PG84B chip model is expected to be in high demand in the future, as the demand for high-performance digital signal processing, embedded processing and image processing increases.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||