
AMD Xilinx
XC3020-70CQ100B
XC3020-70CQ100B ECAD Model
XC3020-70CQ100B Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 64 | |
Number of Outputs | 64 | |
Number of Logic Cells | 64 | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | 38535Q/M;38534H;883B | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 64 CLBS, 2000 GATES | |
Additional Feature | MAX 64 I/OS; 256 FLIP-FLOPS | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-CQFP-F100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 100 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QFF | |
Package Equivalence Code | QFL100,.7SQ,25 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 635 µm | |
Terminal Position | QUAD | |
Width | 17.272 mm | |
Length | 17.272 mm | |
Seated Height-Max | 3.683 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | QFF, QFL100,.7SQ,25 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Part Package Code | QFP | |
Pin Count | 100 | |
ECCN Code | 3A001.A.2.C |
XC3020-70CQ100B Datasheet Download
XC3020-70CQ100B Overview
The XC3020-70CQ100B chip model is a highly advanced and powerful model that has been designed with the intention of providing users with an efficient and reliable solution for their communication needs. This model is a part of the Xilinx family of products, which is one of the most popular and well-known families of chips in the world. The XC3020-70CQ100B chip model is capable of providing users with a wide range of features and capabilities, such as high-speed data transfer, low power consumption, and the ability to handle complex tasks.
The XC3020-70CQ100B chip model is capable of providing users with a great deal of flexibility and scalability in terms of its applications. It can be used in a variety of communication systems, including wired and wireless networks, as well as in the more advanced areas of intelligent systems. This chip model can be used in a variety of scenarios, such as providing high-speed data transfer, low power consumption, and the ability to handle complex tasks. It can also be used in the era of fully intelligent systems, as it is capable of providing users with a great deal of flexibility and scalability in terms of its applications.
The XC3020-70CQ100B chip model has a number of specific design requirements that must be met in order for it to be used in various applications. These requirements include the ability to handle high-speed data transfer, low power consumption, and the ability to handle complex tasks. Additionally, the chip model must also be able to handle the various protocols and technologies that are used in the communications industry. In order to ensure that the chip model is able to meet these requirements, a number of tests and case studies must be conducted in order to ensure that the chip model meets all of the necessary requirements.
In order to ensure that the XC3020-70CQ100B chip model is able to meet all of the requirements, it is important to understand the product description and specific design requirements of the chip model. Additionally, it is important to understand the possible future applications of the chip model in networks and which intelligent scenarios it may be applied to. Finally, it is important to understand the actual case studies and precautions that must be taken in order to ensure that the chip model is able to meet all of the necessary requirements. By understanding all of these requirements, users will be able to ensure that the XC3020-70CQ100B chip model is able to meet their needs and provide them with an efficient and reliable solution for their communication needs.
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