AMD Xilinx
XC3020-70CB100B
XC3020-70CB100B ECAD Model
XC3020-70CB100B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CQFP-F100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 100 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK100,2.6SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 19.05 mm | |
| Length | 19.05 mm | |
| Seated Height-Max | 3.429 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | GQFF, TPAK100,2.6SQ,25 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3020-70CB100B Datasheet Download
XC3020-70CB100B Overview
The XC3020-70CB100B chip model is a specialized chip designed to provide a range of solutions for modern communication systems. It is an integrated circuit that combines many components, such as transistors, capacitors, resistors, and other active and passive components, into a single package. This chip model is designed to provide a cost-effective and reliable solution for a wide range of communication applications.
The XC3020-70CB100B chip model is a highly reliable and cost-effective solution for communication systems. It is designed to support various communication protocols, such as Ethernet, Wi-Fi, and cellular networks. This chip model also supports advanced security features, such as encryption, authentication, and access control. It can be used in a variety of applications, such as wireless routers, cellular base stations, and access points.
The XC3020-70CB100B chip model is designed to be easily upgradeable and can be used in a variety of applications. It is designed to provide a reliable and cost-effective solution for communication systems. This chip model is designed to support the latest communication protocols and security features. It is also designed to be easily upgradable and can be used in a variety of applications.
The XC3020-70CB100B chip model is designed to be highly reliable and cost-effective. It is designed to provide a reliable and cost-effective solution for communication systems. The chip model is designed to support the latest communication protocols and security features. It can be used in a variety of applications, such as wireless routers, cellular base stations, and access points.
The XC3020-70CB100B chip model is designed to be easily upgradeable and can be used in a variety of applications. It is designed to provide a reliable and cost-effective solution for communication systems. The chip model is designed to support the latest communication protocols and security features. The chip model also supports advanced security features, such as encryption, authentication, and access control.
The XC3020-70CB100B chip model is designed to be highly reliable and cost-effective. It is designed to provide a reliable and cost-effective solution for communication systems. The chip model is designed to support the latest communication protocols and security features. It is also designed to be easily upgradable and can be used in a variety of applications.
The industry trends of the XC3020-70CB100B chip model and the future development of related industries depend on what specific technologies are needed. The original design intention of the chip model and the possibility of future upgrades will depend on the application environment and the specific design requirements of the chip model. Actual case studies and precautions should also be considered when using the chip model.
In conclusion, the XC3020-70CB100B chip model is a highly reliable and cost-effective solution for communication systems. It is designed to support the latest communication protocols and security features and can be used in a variety of applications. The industry trends and future development of related industries depend on what specific technologies are needed, and the original design intention and possibility of future upgrades depend on the application environment and specific design requirements of the chip model. Actual case studies and precautions should also be considered when using the chip model.
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