AMD Xilinx
XC3020-125PC68C
XC3020-125PC68C ECAD Model
XC3020-125PC68C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 5.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 4.445 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC68,1.0SQ | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3020-125PC68C Datasheet Download
XC3020-125PC68C Overview
The chip model XC3020-125PC68C is designed for high-performance digital signal processing, embedded processing, and image processing applications. It is a high-performance, low-power FPGA with a wide range of features and capabilities. This chip model is designed to be used in conjunction with the HDL language, which is the standard for digital signal processing.
The original design intention of the chip model XC3020-125PC68C was to provide a powerful, low-power solution for digital signal processing. It was designed to be used in a wide range of applications, from consumer electronics to industrial automation. The chip model is highly flexible and can be upgraded with new features and capabilities. It can also be used in advanced communication systems, such as those used in 5G networks.
The product description of the chip model XC3020-125PC68C includes its features, capabilities, and specifications. It has a wide range of features, such as high-performance signal processing, embedded processing, and image processing. It also offers a wide range of I/O options, including LVDS, PCIe, and USB. It is designed to be used in conjunction with the HDL language and has a wide range of features and capabilities.
The design requirements of the chip model XC3020-125PC68C include the use of the HDL language, as well as the need for a wide range of I/O options. It is important to ensure that the chip model is properly configured to meet the needs of the application. In addition, there are a number of precautions that need to be taken when using the chip model, such as ensuring that the power requirements are met and that the signal integrity is maintained.
Case studies can provide useful information on the use of the chip model XC3020-125PC68C. For example, a case study may include the details of the application and the results that were achieved. This can provide valuable insight into the performance of the chip model and can help to identify any potential issues.
In conclusion, the chip model XC3020-125PC68C is a powerful, low-power solution for digital signal processing, embedded processing, and image processing applications. It is designed to be used in conjunction with the HDL language and has a wide range of features and capabilities. It can be used in a wide range of applications, from consumer electronics to industrial automation, and can be upgraded with new features and capabilities. It is important to ensure that the chip model is properly configured and that the power requirements and signal integrity are maintained. Case studies can provide valuable insight into the performance of the chip model and can help to identify any potential issues.
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2,223 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7.8566 | $7.8566 |
| 10+ | $7.7722 | $77.7216 |
| 100+ | $7.3498 | $734.9760 |
| 1000+ | $6.9274 | $3,463.6800 |
| 10000+ | $6.3360 | $6,336.0000 |
| The price is for reference only, please refer to the actual quotation! | ||