AMD Xilinx
XC3020-100CB100M
XC3020-100CB100M ECAD Model
XC3020-100CB100M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CQFP-F100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 100 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK100,2.6SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 19.05 mm | |
| Length | 19.05 mm | |
| Seated Height-Max | 2.921 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | GQFF, TPAK100,2.6SQ,25 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3020-100CB100M Datasheet Download
XC3020-100CB100M Overview
The XC3020-100CB100M is a chip model that has been developed to meet the needs of modern technology. It is a powerful, high-performance chip model that is designed to be used in a variety of applications. It is suitable for use in industrial, medical, and consumer electronics.
The XC3020-100CB100M chip model is based on the latest technology and has been designed to provide high-speed performance and low power consumption. It is equipped with a variety of features and functions, such as multiple cores, high-speed memory, and advanced encryption. This chip model also offers a wide range of features and capabilities, including a high-speed processor, advanced encryption, and a wide range of I/O ports.
The XC3020-100CB100M chip model is designed to provide the highest levels of performance and reliability. It is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics. The chip model has been designed to provide the highest levels of performance and reliability in all of these applications.
The XC3020-100CB100M chip model is designed to meet the needs of modern technology. It is designed to provide the highest levels of performance and reliability in a variety of applications. It is also designed to be used in a variety of environments, including automotive, industrial, medical, and consumer electronics.
The XC3020-100CB100M chip model is designed to provide the highest levels of performance and reliability. It is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics. The chip model is also designed to provide the highest levels of performance and reliability in all of these applications.
The XC3020-100CB100M chip model is expected to be in high demand in the future. This is due to its high performance and low power consumption, as well as its wide range of features and capabilities. The chip model is also designed to provide the highest levels of performance and reliability in all of these applications.
The product description and specific design requirements of the XC3020-100CB100M chip model are available on the manufacturer's website. The product description and design requirements are designed to provide the highest levels of performance and reliability in all of these applications. It is important to note that the product description and design requirements should be followed closely when using the chip model.
Actual case studies and precautions should be taken when using the XC3020-100CB100M chip model. It is important to note that the product description and design requirements should be followed closely when using the chip model. It is also important to note that the chip model should be tested and validated before being used in any application.
In conclusion, the XC3020-100CB100M chip model is a powerful, high-performance chip model that is designed to be used in a variety of applications. It is designed to provide the highest levels of performance and reliability in all of these applications. It is expected to be in high demand in the future due to its high performance and low power consumption, as well as its wide range of features and capabilities. The product description and design requirements should be followed closely when using the chip model, and actual case studies and precautions should be taken when using the chip model.
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