XC2VP70-7FFG1704I
XC2VP70-7FFG1704I
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rohs

AMD Xilinx

XC2VP70-7FFG1704I


XC2VP70-7FFG1704I
F20-XC2VP70-7FFG1704I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1 MM PITCH, FLIP CHIP, FBGA-1704
1 MM PITCH, FLIP CHIP, FBGA-1704

XC2VP70-7FFG1704I ECAD Model


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XC2VP70-7FFG1704I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.35 GHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1704
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1704
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.45 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1 MM PITCH, FLIP CHIP, FBGA-1704
Pin Count 1704
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP70-7FFG1704I Datasheet Download


XC2VP70-7FFG1704I Overview



XC2VP70-7FFG1704I is a chip model developed by Xilinx, a leader in the field of programmable logic devices. It is a high-performance, low-power, and cost-effective FPGA, which is widely used in various fields such as high-performance digital signal processing, embedded processing, image processing, etc. It uses the Verilog or VHDL language to design, which can meet the requirements of most digital designs.


The advantages of the XC2VP70-7FFG1704I chip model are many. Firstly, it has low power consumption and high performance, which makes it suitable for a wide range of applications. Secondly, it is highly configurable, which allows users to customize the design to their specific needs. Thirdly, it is compatible with various development tools, which makes it easy to use. Lastly, it is cost-effective, which makes it a great choice for budget-conscious users.


The expected demand for the XC2VP70-7FFG1704I chip model in related industries is expected to increase in the future. As the demand for high-performance digital signal processing, embedded processing, image processing, and other applications increases, so does the need for FPGA solutions. As the XC2VP70-7FFG1704I chip model is a cost-effective and reliable solution, it is expected to be in high demand in the future.


The product description and specific design requirements of the XC2VP70-7FFG1704I chip model are as follows: it is a Xilinx Virtex-II Pro FPGA with a capacity of 7,000 logic cells and 4,704 flip-flops. It also has 512Kb of RAM, 16 DSP slices, and a maximum operating frequency of 200 MHz. It is designed for use in high-performance digital signal processing, embedded processing, image processing, and other applications.


In terms of design, the XC2VP70-7FFG1704I chip model requires the use of Verilog or VHDL language. It is important to note that the design must be optimized for the target device, and the design must be verified before implementation. In addition, the design should be tested extensively to ensure that it meets the required performance and reliability standards.


To illustrate the use of the XC2VP70-7FFG1704I chip model, a case study of a digital signal processing application is provided. The application was designed using Verilog, and it was tested extensively to ensure that it met the required performance and reliability standards. The design was then optimized for the target device, and the design was verified before implementation.


In conclusion, the XC2VP70-7FFG1704I chip model is a high-performance, low-power, and cost-effective FPGA which is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is expected to be in high demand in the future due to its cost-effectiveness and reliability. The design of the chip model requires the use of Verilog or VHDL language, and it is important to optimize the design for the target device and verify the design before implementation.



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