
AMD Xilinx
XC2VP70-7FFG1704I
XC2VP70-7FFG1704I ECAD Model
XC2VP70-7FFG1704I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1704 | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VP70-7FFG1704I Datasheet Download
XC2VP70-7FFG1704I Overview
XC2VP70-7FFG1704I is a chip model developed by Xilinx, a leader in the field of programmable logic devices. It is a high-performance, low-power, and cost-effective FPGA, which is widely used in various fields such as high-performance digital signal processing, embedded processing, image processing, etc. It uses the Verilog or VHDL language to design, which can meet the requirements of most digital designs.
The advantages of the XC2VP70-7FFG1704I chip model are many. Firstly, it has low power consumption and high performance, which makes it suitable for a wide range of applications. Secondly, it is highly configurable, which allows users to customize the design to their specific needs. Thirdly, it is compatible with various development tools, which makes it easy to use. Lastly, it is cost-effective, which makes it a great choice for budget-conscious users.
The expected demand for the XC2VP70-7FFG1704I chip model in related industries is expected to increase in the future. As the demand for high-performance digital signal processing, embedded processing, image processing, and other applications increases, so does the need for FPGA solutions. As the XC2VP70-7FFG1704I chip model is a cost-effective and reliable solution, it is expected to be in high demand in the future.
The product description and specific design requirements of the XC2VP70-7FFG1704I chip model are as follows: it is a Xilinx Virtex-II Pro FPGA with a capacity of 7,000 logic cells and 4,704 flip-flops. It also has 512Kb of RAM, 16 DSP slices, and a maximum operating frequency of 200 MHz. It is designed for use in high-performance digital signal processing, embedded processing, image processing, and other applications.
In terms of design, the XC2VP70-7FFG1704I chip model requires the use of Verilog or VHDL language. It is important to note that the design must be optimized for the target device, and the design must be verified before implementation. In addition, the design should be tested extensively to ensure that it meets the required performance and reliability standards.
To illustrate the use of the XC2VP70-7FFG1704I chip model, a case study of a digital signal processing application is provided. The application was designed using Verilog, and it was tested extensively to ensure that it met the required performance and reliability standards. The design was then optimized for the target device, and the design was verified before implementation.
In conclusion, the XC2VP70-7FFG1704I chip model is a high-performance, low-power, and cost-effective FPGA which is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is expected to be in high demand in the future due to its cost-effectiveness and reliability. The design of the chip model requires the use of Verilog or VHDL language, and it is important to optimize the design for the target device and verify the design before implementation.
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