
AMD Xilinx
XC2VP70-7FFG1517I
XC2VP70-7FFG1517I ECAD Model
XC2VP70-7FFG1517I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1517 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VP70-7FFG1517I Datasheet Download
XC2VP70-7FFG1517I Overview
The chip model XC2VP70-7FFG1517I is a breakthrough product in the field of high-end system-on-chip (SoC) technology. It is a multi-core, high-performance, high-efficiency, low-power SoC designed by Xilinx. This model can be used in a variety of applications, including industrial automation, medical imaging, automotive, aerospace, and consumer electronics.
The XC2VP70-7FFG1517I chip model has a number of advantages that make it attractive to many industries. It has a high-performance, low-power multi-core processor, which can provide high-speed processing capabilities while consuming less power. It also has a large memory capacity, which can be used to store large amounts of data. Furthermore, its advanced communication system can provide high-speed data transfer and communication between different devices.
The XC2VP70-7FFG1517I chip model has been designed for use in a variety of applications, and its popularity is expected to continue to grow in the future. With its advanced features and capabilities, it is expected to be widely used in the industrial automation, medical imaging, automotive, aerospace, and consumer electronics industries. As technology advances, the demand for this model is expected to further increase.
The XC2VP70-7FFG1517I chip model was originally designed for use in high-end communication systems. Its advanced features and capabilities make it suitable for use in a variety of applications. It has the potential to be used in the development and popularization of future intelligent robots, as its advanced communication system can provide high-speed data transfer and communication between different devices.
In order to use the XC2VP70-7FFG1517I chip model effectively, certain technical talents are needed. It is important to have knowledge of embedded systems, digital signal processing, and digital design. It is also important to have experience in the development of communication systems and embedded systems. Additionally, knowledge of computer architecture and programming languages is necessary for proper utilization of the chip model.
Overall, the XC2VP70-7FFG1517I chip model is a powerful, high-performance, low-power SoC that has a wide range of applications. Its advanced features and capabilities make it suitable for use in a variety of industries, and its popularity is expected to continue to grow in the future. Furthermore, it has the potential to be used in the development and popularization of future intelligent robots, and certain technical talents are needed in order to use the model effectively.
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