XC2VP70-7FFG1517I
XC2VP70-7FFG1517I
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rohs

AMD Xilinx

XC2VP70-7FFG1517I


XC2VP70-7FFG1517I
F20-XC2VP70-7FFG1517I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1 MM PITCH, FLIP CHIP, FBGA-1517
1 MM PITCH, FLIP CHIP, FBGA-1517

XC2VP70-7FFG1517I ECAD Model


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XC2VP70-7FFG1517I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.35 GHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1 MM PITCH, FLIP CHIP, FBGA-1517
Pin Count 1517
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP70-7FFG1517I Datasheet Download


XC2VP70-7FFG1517I Overview



The chip model XC2VP70-7FFG1517I is a breakthrough product in the field of high-end system-on-chip (SoC) technology. It is a multi-core, high-performance, high-efficiency, low-power SoC designed by Xilinx. This model can be used in a variety of applications, including industrial automation, medical imaging, automotive, aerospace, and consumer electronics.


The XC2VP70-7FFG1517I chip model has a number of advantages that make it attractive to many industries. It has a high-performance, low-power multi-core processor, which can provide high-speed processing capabilities while consuming less power. It also has a large memory capacity, which can be used to store large amounts of data. Furthermore, its advanced communication system can provide high-speed data transfer and communication between different devices.


The XC2VP70-7FFG1517I chip model has been designed for use in a variety of applications, and its popularity is expected to continue to grow in the future. With its advanced features and capabilities, it is expected to be widely used in the industrial automation, medical imaging, automotive, aerospace, and consumer electronics industries. As technology advances, the demand for this model is expected to further increase.


The XC2VP70-7FFG1517I chip model was originally designed for use in high-end communication systems. Its advanced features and capabilities make it suitable for use in a variety of applications. It has the potential to be used in the development and popularization of future intelligent robots, as its advanced communication system can provide high-speed data transfer and communication between different devices.


In order to use the XC2VP70-7FFG1517I chip model effectively, certain technical talents are needed. It is important to have knowledge of embedded systems, digital signal processing, and digital design. It is also important to have experience in the development of communication systems and embedded systems. Additionally, knowledge of computer architecture and programming languages is necessary for proper utilization of the chip model.


Overall, the XC2VP70-7FFG1517I chip model is a powerful, high-performance, low-power SoC that has a wide range of applications. Its advanced features and capabilities make it suitable for use in a variety of industries, and its popularity is expected to continue to grow in the future. Furthermore, it has the potential to be used in the development and popularization of future intelligent robots, and certain technical talents are needed in order to use the model effectively.



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