AMD Xilinx
XC2VP70-7FFG1517C
XC2VP70-7FFG1517C ECAD Model
XC2VP70-7FFG1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 964 | |
| Number of Outputs | 964 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
XC2VP70-7FFG1517C Datasheet Download
XC2VP70-7FFG1517C Overview
The XC2VP70-7FFG1517C chip model is a powerful and versatile processor, capable of handling a wide range of tasks. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The future of the XC2VP70-7FFG1517C chip model and related industries depend on the specific technologies needed for its application environment. The chip model is capable of being used in networks and for intelligent scenarios, and it is possible for it to be used in the era of fully intelligent systems.
The XC2VP70-7FFG1517C chip model has the potential to revolutionize the way we interact with technology, allowing us to build smarter, more efficient systems. With its powerful processing capabilities, the chip model is capable of handling complex tasks, such as image processing, embedded processing, and digital signal processing. It can also be used in networks and for intelligent scenarios, allowing us to build smarter systems with more efficient communication between devices.
The XC2VP70-7FFG1517C chip model is also suitable for the era of fully intelligent systems, as it has the potential to enable machines to interact with their environment in a more natural way. With the use of advanced algorithms, the chip model can be used to create systems that can learn from their environment and adapt to changing conditions. This could lead to more efficient and effective solutions to a variety of tasks.
The XC2VP70-7FFG1517C chip model is a powerful and versatile processor, and its future applications are only limited by the imagination. With its ability to handle complex tasks, its use in networks, and its potential to be used in the era of fully intelligent systems, the chip model is sure to be a major player in the development of the future of technology.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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