AMD Xilinx
XC2VP70-7FF1704I
XC2VP70-7FF1704I ECAD Model
XC2VP70-7FF1704I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 996 | |
| Number of Outputs | 996 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1704,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1704 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP70-7FF1704I Datasheet Download
XC2VP70-7FF1704I Overview
The chip model XC2VP70-7FF1704I is a cutting-edge technology developed by Xilinx, Inc. It is a field programmable gate array (FPGA) that is designed to provide users with a high level of performance, flexibility, and scalability. It is capable of supporting a wide range of applications, from basic logic to complex algorithms.
The XC2VP70-7FF1704I is designed to be used in a variety of industries, such as automotive, aerospace, healthcare, industrial, networking, and more. It offers users a way to quickly and easily develop and deploy applications that require high levels of performance, flexibility, and scalability. The chip model is also capable of supporting the latest in emerging technologies, such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT).
The XC2VP70-7FF1704I is expected to become increasingly popular in the future, as it is designed to be highly versatile and able to support a wide range of applications. It is also capable of being used in a variety of intelligent scenarios, such as autonomous vehicles, smart factories, and smart homes. In addition, it is capable of being used in the era of fully intelligent systems, such as the development of autonomous robots and drones.
The chip model XC2VP70-7FF1704I is expected to be used in a variety of networks in the future, including 5G networks, Wi-Fi networks, and IoT networks. It is also expected to be used in a variety of intelligent scenarios, such as intelligent traffic management, smart city development, and intelligent healthcare. The XC2VP70-7FF1704I is also capable of being used in the era of fully intelligent systems, such as autonomous robots and drones.
Overall, the XC2VP70-7FF1704I is a powerful and versatile chip model that is expected to become increasingly popular in the future. It is capable of supporting a wide range of applications, from basic logic to complex algorithms, and it is designed to be used in a variety of industries, networks, and intelligent scenarios. The XC2VP70-7FF1704I is also capable of being used in the era of fully intelligent systems, such as the development of autonomous robots and drones. As such, it is expected to become increasingly popular in the future and be used in a variety of different applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||