AMD Xilinx
XC2VP70-7FF1517I
XC2VP70-7FF1517I ECAD Model
XC2VP70-7FF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 964 | |
| Number of Outputs | 964 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP70-7FF1517I Datasheet Download
XC2VP70-7FF1517I Overview
The XC2VP70-7FF1517I chip model is an advanced, high-performance model that is designed to provide users with the most efficient and reliable performance. It is a field programmable gate array (FPGA) that is suitable for a wide range of applications, such as embedded systems, communications, and industrial control.
The XC2VP70-7FF1517I chip model offers a number of advantages over other models, including a higher speed, higher density, and lower power consumption. It is also designed to support a variety of communication protocols, including Ethernet, USB, Serial, and CAN. Furthermore, it is designed to be compatible with a wide range of software, such as Verilog, VHDL, and C++.
The XC2VP70-7FF1517I chip model is designed to meet the needs of the most demanding applications. It is a highly reliable and efficient model that is designed to provide users with the most efficient performance possible. As a result, it is expected to experience strong demand in the future in various industries, including automotive, medical, industrial, and communication.
The original design intention of the XC2VP70-7FF1517I chip model was to provide users with the highest levels of performance and reliability. The model is designed to be highly configurable and can be easily upgraded to meet the needs of future applications. It is also designed to be compatible with advanced communication systems, such as 5G, Wi-Fi, and Bluetooth.
The product description and specific design requirements of the XC2VP70-7FF1517I chip model include a wide range of features and capabilities. It is designed to support a variety of communication protocols, such as Ethernet, USB, Serial, and CAN. It is also designed to be compatible with a wide range of software, such as Verilog, VHDL, and C++. Furthermore, it is designed to be highly configurable and can be easily upgraded to meet the needs of future applications.
In addition to the product description and design requirements, there are a number of actual case studies and precautions that should be taken into account when using the XC2VP70-7FF1517I chip model. For example, it is important to ensure that the chip model is properly configured to meet the needs of the application. It is also important to ensure that the chip model is properly protected against external interference. Additionally, it is important to ensure that the chip model is properly cooled to prevent overheating.
Overall, the XC2VP70-7FF1517I chip model is an advanced, high-performance model that is designed to provide users with the most efficient and reliable performance. It is expected to experience strong demand in the future in various industries, including automotive, medical, industrial, and communication. It is designed to be highly configurable and can be easily upgraded to meet the needs of future applications. Furthermore, it is designed to be compatible with advanced communication systems, such as 5G, Wi-Fi, and Bluetooth. It is important to ensure that the chip model is properly configured, protected, and cooled in order to ensure optimal performance.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||