
AMD Xilinx
XC2VP70-6FFG1517I
XC2VP70-6FFG1517I ECAD Model
XC2VP70-6FFG1517I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 964 | |
Number of Outputs | 964 | |
Number of Logic Cells | 74448 | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1517,39X39,40 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2VP70-6FFG1517I Datasheet Download
XC2VP70-6FFG1517I Overview
The Xilinx XC2VP70-6FFG1517I chip is a programmable logic device that is designed to provide a wide range of features and functions. It is a high-performance, low-power, and cost-effective device that can be used for various applications. It is a field-programmable gate array (FPGA) that can be used to implement a variety of designs, including digital signal processing (DSP) and communication systems.
The XC2VP70-6FFG1517I chip was designed with the intention of providing a powerful and versatile solution for a wide range of applications. It can be used to build a variety of complex systems, including advanced communication systems, industrial automation systems, and embedded systems. The chip has been designed with the latest technologies, including programmable logic, memory, and I/O capabilities. It also features a variety of features, including high-speed data transfer, low power consumption, and a wide range of I/O options.
The XC2VP70-6FFG1517I chip is also capable of being upgraded in the future. It has a number of features that can be used to upgrade and customize the design, including the ability to add more memory, I/O ports, and other features. The chip also has a number of features that can be used to optimize the design, including the ability to reduce power consumption and maximize performance.
The XC2VP70-6FFG1517I chip can also be used to develop and popularize future intelligent robots. It has the capability to implement a variety of algorithms, including those used in artificial intelligence and machine learning. The chip is also capable of handling a wide range of data, including sensory inputs and control signals. In order to use the XC2VP70-6FFG1517I chip effectively, it is important to have a good understanding of the chip's features and capabilities.
When using the XC2VP70-6FFG1517I chip, it is important to be aware of the specific design requirements that must be met. It is also important to be aware of the potential risks and pitfalls associated with using the chip. It is important to consider the potential costs and benefits of using the chip in the design of a system. Additionally, it is important to understand the potential implications of using the chip in a system, such as the potential for increased power consumption or the potential for increased complexity.
In conclusion, the XC2VP70-6FFG1517I chip is a powerful and versatile device that can be used for a variety of applications. It has the capability to be upgraded in the future, and can be used to develop and popularize future intelligent robots. In order to use the chip effectively, it is important to have a good understanding of the chip's features and capabilities, as well as the potential risks and pitfalls associated with using the chip.
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3,261 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,179.8143 | $4,179.8143 |
10+ | $4,134.8701 | $41,348.7008 |
100+ | $3,910.1489 | $391,014.8880 |
1000+ | $3,685.4277 | $1,842,713.8400 |
10000+ | $3,370.8180 | $3,370,818.0000 |
The price is for reference only, please refer to the actual quotation! |