XC2VP70-6FF1704I

The XC2VP70-6FF1704I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a high-performance, high-density device that features two million system gates and 70,000 logic cells. It is also equipped with 6,000 Flip-Flops, 6,000 I/O pins and 17,040 RAM blocks.

This chip has a maximum clock frequency of 200 MHz and a power dissipation of 1.5 W. It has an operating temperature range of -40°C to +85°C and is designed for use in commercial, industrial and automotive applications. It is also suitable for use in high-speed networking, data communications, image processing and signal processing applications.

The XC2VP70-6FF1704I is a feature-rich device that offers many advantages such as high performance, low power consumption, high reliability, fast reconfiguration and low cost. It is also designed for use in applications where high-speed, high-density and low-power are required.

The XC2VP70-6FF1704I is a versatile chip that is suitable for a wide range of applications such as industrial control, automotive control, medical imaging, video and graphics processing, telecommunications and networking, digital signal processing and embedded systems. It is also suitable for use in applications where high-speed, low-power and high-density are required.