AMD Xilinx
XC2VP70-5FFG1517I
XC2VP70-5FFG1517I ECAD Model
XC2VP70-5FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 964 | |
| Number of Outputs | 964 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 360 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.05 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2VP70-5FFG1517I Datasheet Download
XC2VP70-5FFG1517I Overview
Xilinx’s XC2VP70-5FFG1517I chip model is a versatile and powerful integrated circuit that is designed for a wide range of applications. This model is a cost-effective solution for many industries, offering high performance and reliability. It is also highly customizable, allowing users to make modifications to suit their specific needs.
The XC2VP70-5FFG1517I chip model has a number of advantages that make it an attractive choice for many industries. It is capable of processing a wide range of data types, including digital signals, analog signals, and audio signals. It also features a low power consumption, making it ideal for applications that require energy efficiency. Additionally, the chip model offers a high level of integration, allowing users to combine multiple components into a single integrated circuit.
The XC2VP70-5FFG1517I chip model is expected to be in high demand in the future, due to its versatility and cost-effectiveness. This chip model is suitable for a wide range of applications, including communications, automotive, consumer electronics, and medical devices. As technology advances, the demand for more advanced integrated circuits is likely to increase, making the XC2VP70-5FFG1517I chip model an attractive choice for many industries.
The original design intention of the XC2VP70-5FFG1517I chip model was to provide a cost-effective solution for many industries. This chip model was designed to be highly customizable, allowing users to make modifications to suit their specific needs. In addition, the chip model was designed to be compatible with a range of different communication systems, making it suitable for a wide range of applications.
The XC2VP70-5FFG1517I chip model is capable of being upgraded in the future, allowing users to take advantage of new technologies as they become available. This chip model is also suitable for advanced communication systems, such as those used in automotive, consumer electronics, and medical devices. In addition, the chip model is capable of supporting a range of different data types, making it suitable for a wide range of applications.
The product description and specific design requirements of the XC2VP70-5FFG1517I chip model should be carefully considered before making a purchase. This chip model is designed for a wide range of applications, so it is important to understand the specific needs of the user before making a purchase. Additionally, it is important to consider the actual case studies and the potential risks associated with using this chip model. For example, users should be aware of the potential for data loss and the potential for compatibility issues with other components.
Overall, the XC2VP70-5FFG1517I chip model is a versatile and powerful integrated circuit that is designed for a wide range of applications. It offers a cost-effective solution for many industries, while also offering a high level of integration and energy efficiency. The chip model is expected to be in high demand in the future, and is capable of being upgraded to take advantage of new technologies. Additionally, the product description and specific design requirements of the chip model should be carefully considered before making a purchase, as well as the actual case studies and potential risks associated with using this chip model.
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4,546 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,985.6869 | $2,985.6869 |
| 10+ | $2,953.5827 | $29,535.8272 |
| 100+ | $2,793.0619 | $279,306.1920 |
| 1000+ | $2,632.5411 | $1,316,270.5600 |
| 10000+ | $2,407.8120 | $2,407,812.0000 |
| The price is for reference only, please refer to the actual quotation! | ||