AMD Xilinx
XC2VP50-7FFG1517I
XC2VP50-7FFG1517I ECAD Model
XC2VP50-7FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 5904 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5904 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP50-7FFG1517I Datasheet Download
XC2VP50-7FFG1517I Overview
The XC2VP50-7FFG1517I is a chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is an advanced integrated circuit that requires the use of HDL language to program and operate. This chip model has numerous advantages that make it suitable for a variety of applications, from industrial robotics to consumer electronics.
The XC2VP50-7FFG1517I is capable of performing complex calculations with great speed and accuracy. It has a wide range of features, including a high-speed bus, a powerful memory controller, and an embedded processor. The chip model also supports a variety of communication protocols, making it suitable for a variety of applications. In addition, the chip model is highly reliable and efficient, making it suitable for many industrial applications.
The demand for the XC2VP50-7FFG1517I is expected to increase in the future due to its high performance and reliability. As the technology progresses, more applications will be developed that require the use of this chip model. This will create more opportunities for the model to be used in a variety of industries.
The XC2VP50-7FFG1517I can also be used for the development and popularization of future intelligent robots. It is capable of performing complex calculations quickly and accurately, making it suitable for a variety of robotic applications. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and computer scientists are necessary. These professionals must have a good understanding of HDL language and be able to program and operate the chip model.
Overall, the XC2VP50-7FFG1517I is an advanced integrated circuit that is suitable for a variety of applications. It has numerous advantages and is expected to be in high demand in the future. In addition, it can be used for the development and popularization of future intelligent robots. To use the model effectively, technical talents such as software engineers, hardware engineers, and computer scientists are necessary.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||