AMD Xilinx
XC2VP50-7FFG1152I
XC2VP50-7FFG1152I ECAD Model
XC2VP50-7FFG1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 5904 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5904 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP50-7FFG1152I Datasheet Download
XC2VP50-7FFG1152I Overview
The XC2VP50-7FFG1152I chip model is a powerful and versatile device that is suitable for a variety of applications. It is designed to be used in high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language to program and configure the device. This makes it an ideal choice for applications in networks and intelligent scenarios.
The XC2VP50-7FFG1152I chip model is a high-performance device that can process data quickly and accurately. It is equipped with a wide range of features and functions that make it suitable for a variety of applications. It has a low power consumption and is designed to be used in a variety of environments.
The XC2VP50-7FFG1152I chip model is a great choice for applications that require high performance and accuracy. It can be used in fully intelligent systems, as it is designed to be used with HDL language. It is also suitable for applications that require a high degree of precision and accuracy.
When designing a system that uses the XC2VP50-7FFG1152I chip model, it is important to take into consideration the specific design requirements and product description. It is also important to consider the actual case studies and precautions when using this device. It is important to note that the device is not suitable for all applications and that it is best used for applications that require high performance and accuracy.
When using the XC2VP50-7FFG1152I chip model, it is important to ensure that the device is configured correctly and that all of the necessary safety precautions are taken. It is also important to ensure that the device is used in the correct environment and that it is used in accordance with the product description and design requirements.
Overall, the XC2VP50-7FFG1152I chip model is a powerful and versatile device that is suitable for a variety of applications. It is designed to be used in high-performance digital signal processing, embedded processing, and image processing. It is suitable for applications in networks and intelligent scenarios, and it is capable of being used in fully intelligent systems. It is important to consider the specific design requirements and product description, as well as actual case studies and precautions when using this device.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||