
AMD Xilinx
XC2VP50-7FFG1148C
XC2VP50-7FFG1148C ECAD Model
XC2VP50-7FFG1148C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 812 | |
Number of Outputs | 812 | |
Number of Logic Cells | 53136 | |
Number of CLBs | 5904 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5904 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1148 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1148 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1148,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1148,34X34,40 | |
Pin Count | 1148 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.7.A |
XC2VP50-7FFG1148C Datasheet Download
XC2VP50-7FFG1148C Overview
The chip model XC2VP50-7FFG1148C is an important component of the semiconductor industry, and its development has a great impact on the industry. As a chip model released by Xilinx, it has been widely used in various industries since its launch. It is based on the Virtex-II Pro FPGA platform and can provide up to 50 million system gates. It also has a large number of I/O pins, which can be used to connect a variety of peripherals and make it easier to achieve complex functions.
The chip model XC2VP50-7FFG1148C has a wide range of applications, and can be used in various fields such as industrial automation, communication, medical, aerospace and defense. It can be used to design and develop a variety of advanced systems, such as high-speed communication systems, high-precision control systems, and high-performance signal processing systems. It is also suitable for system-level design and can be used to develop complex systems with multiple functions.
In terms of industry trends, the chip model XC2VP50-7FFG1148C has the potential to be upgraded in the future. It has the ability to support new technologies, such as high-speed serial links, high-speed memory interfaces, and high-speed digital signal processing. In addition, it can also be used in advanced communication systems, such as 5G networks and the Internet of Things.
In terms of product description, the chip model XC2VP50-7FFG1148C has a wide range of features, including a high-speed system clock, high-speed memory interface, and high-speed I/O pins. It also has a large number of I/O pins, which can be used to connect a variety of peripherals and make it easier to achieve complex functions. In addition, it is also equipped with a variety of advanced features, such as error-correction codes, dynamic power management, and flash memory.
When using the chip model XC2VP50-7FFG1148C, it is important to pay attention to the actual case studies and precautions. For example, when designing the system, it is necessary to consider the system’s power consumption, signal integrity, and other factors. In addition, it is necessary to pay attention to the timing of the system, and the system should not be designed to run at a frequency that exceeds the maximum frequency of the chip model.
In conclusion, the chip model XC2VP50-7FFG1148C is a powerful and versatile chip model, and its application can bring great benefits to various industries. It has the potential to be upgraded in the future, and can support new technologies, making it suitable for advanced communication systems. When using the chip model, it is important to pay attention to the actual case studies and precautions.
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