XC2VP50-7FFG1148C
XC2VP50-7FFG1148C
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rohs

AMD Xilinx

XC2VP50-7FFG1148C


XC2VP50-7FFG1148C
F20-XC2VP50-7FFG1148C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1148,34X34,40
BGA, BGA1148,34X34,40

XC2VP50-7FFG1148C ECAD Model


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XC2VP50-7FFG1148C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 812
Number of Outputs 812
Number of Logic Cells 53136
Number of CLBs 5904
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 5904 CLBS
Clock Frequency-Max 1.35 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1148
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1148
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1148,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA1148,34X34,40
Pin Count 1148
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.7.A

XC2VP50-7FFG1148C Datasheet Download


XC2VP50-7FFG1148C Overview



The chip model XC2VP50-7FFG1148C is an important component of the semiconductor industry, and its development has a great impact on the industry. As a chip model released by Xilinx, it has been widely used in various industries since its launch. It is based on the Virtex-II Pro FPGA platform and can provide up to 50 million system gates. It also has a large number of I/O pins, which can be used to connect a variety of peripherals and make it easier to achieve complex functions.


The chip model XC2VP50-7FFG1148C has a wide range of applications, and can be used in various fields such as industrial automation, communication, medical, aerospace and defense. It can be used to design and develop a variety of advanced systems, such as high-speed communication systems, high-precision control systems, and high-performance signal processing systems. It is also suitable for system-level design and can be used to develop complex systems with multiple functions.


In terms of industry trends, the chip model XC2VP50-7FFG1148C has the potential to be upgraded in the future. It has the ability to support new technologies, such as high-speed serial links, high-speed memory interfaces, and high-speed digital signal processing. In addition, it can also be used in advanced communication systems, such as 5G networks and the Internet of Things.


In terms of product description, the chip model XC2VP50-7FFG1148C has a wide range of features, including a high-speed system clock, high-speed memory interface, and high-speed I/O pins. It also has a large number of I/O pins, which can be used to connect a variety of peripherals and make it easier to achieve complex functions. In addition, it is also equipped with a variety of advanced features, such as error-correction codes, dynamic power management, and flash memory.


When using the chip model XC2VP50-7FFG1148C, it is important to pay attention to the actual case studies and precautions. For example, when designing the system, it is necessary to consider the system’s power consumption, signal integrity, and other factors. In addition, it is necessary to pay attention to the timing of the system, and the system should not be designed to run at a frequency that exceeds the maximum frequency of the chip model.


In conclusion, the chip model XC2VP50-7FFG1148C is a powerful and versatile chip model, and its application can bring great benefits to various industries. It has the potential to be upgraded in the future, and can support new technologies, making it suitable for advanced communication systems. When using the chip model, it is important to pay attention to the actual case studies and precautions.



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