
AMD Xilinx
XC2VP50-7FF1517I
XC2VP50-7FF1517I ECAD Model
XC2VP50-7FF1517I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 852 | |
Number of Outputs | 852 | |
Number of Logic Cells | 53136 | |
Number of CLBs | 5904 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5904 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1517 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VP50-7FF1517I Datasheet Download
XC2VP50-7FF1517I Overview
The chip model XC2VP50-7FF1517I is a groundbreaking technology that has revolutionized the chip industry. It is a powerful, low-power, and high-performance FPGA that is designed to meet the needs of a wide range of applications. It is capable of providing superior performance in a variety of tasks such as video processing, image recognition, and artificial intelligence.
The industry trends of the chip model XC2VP50-7FF1517I have been growing steadily over the past few years, and with the rapid advancement of technology, the chip model is expected to become even more powerful and efficient. As the technology continues to evolve, the demand for more advanced chip models will also increase. In order to keep up with the changing industry trends, the chip model will need to be supported by new technologies and applications.
The chip model XC2VP50-7FF1517I can be used in a variety of networks and intelligent scenarios. It is capable of providing high-speed data transmission and can be used in a variety of applications such as video streaming and image recognition. It is also capable of providing superior performance in artificial intelligence tasks such as facial recognition and natural language processing.
The chip model XC2VP50-7FF1517I is also capable of being used in the era of fully intelligent systems. It can be used in the development and popularization of future intelligent robots, and its capabilities can be used to develop advanced robots that can perform complex tasks. In order to use the chip model effectively, it is important to have the right technical talents. Technical talents such as software engineers, hardware engineers, and data scientists are required to use the chip model effectively.
In conclusion, the chip model XC2VP50-7FF1517I is a groundbreaking technology that has revolutionized the chip industry. It is capable of providing superior performance in a variety of tasks and can be used in a variety of networks and intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, and technical talents such as software engineers, hardware engineers, and data scientists are required to use the chip model effectively. As the technology continues to evolve, the demand for more advanced chip models will also increase, and the industry trends of the chip model XC2VP50-7FF1517I will continue to grow.
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