
AMD Xilinx
XC2VP50-7FF1517C
XC2VP50-7FF1517C ECAD Model
XC2VP50-7FF1517C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 852 | |
Number of Outputs | 852 | |
Number of Logic Cells | 53136 | |
Number of CLBs | 5904 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5904 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1517,39X39,40 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2VP50-7FF1517C Datasheet Download
XC2VP50-7FF1517C Overview
The chip model XC2VP50-7FF1517C is a new type of field programmable gate array (FPGA) developed by Xilinx. It is a highly integrated and cost-effective FPGA chip that can handle a wide range of applications. It has the advantages of high performance, low power consumption, and small size, making it an ideal choice for embedded applications.
In terms of industry trends, the XC2VP50-7FF1517C is expected to be widely used in the future, especially in the fields of industrial automation, medical devices, and consumer electronics. Its high integration capabilities and low power consumption make it an ideal choice for these applications. In addition, its small size makes it suitable for applications where space is limited.
In terms of future development, the XC2VP50-7FF1517C is expected to be used in the development and popularization of intelligent robots. Its high-performance and low-power consumption capabilities make it suitable for complex tasks such as facial recognition, path planning, and motion control. In order to use the chip model effectively, the application environment needs to support new technologies such as artificial intelligence, deep learning, and machine learning. Technical talents such as software engineers, hardware engineers, and data scientists are needed to develop and implement these technologies.
Overall, the chip model XC2VP50-7FF1517C is an ideal choice for embedded applications due to its high performance, low power consumption, and small size. It is expected to be widely used in the future, especially in the fields of industrial automation, medical devices, and consumer electronics. In addition, it can also be used in the development and popularization of intelligent robots, and the application environment needs to support new technologies such as artificial intelligence, deep learning, and machine learning.
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QTY | Unit Price | Ext Price |
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