XC2VP50-7FF1517C
XC2VP50-7FF1517C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC2VP50-7FF1517C


XC2VP50-7FF1517C
F20-XC2VP50-7FF1517C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XC2VP50-7FF1517C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC2VP50-7FF1517C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 852
Number of Outputs 852
Number of Logic Cells 53136
Number of CLBs 5904
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 5904 CLBS
Clock Frequency-Max 1.35 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA1517,39X39,40
Pin Count 1517
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC2VP50-7FF1517C Datasheet Download


XC2VP50-7FF1517C Overview



The chip model XC2VP50-7FF1517C is a new type of field programmable gate array (FPGA) developed by Xilinx. It is a highly integrated and cost-effective FPGA chip that can handle a wide range of applications. It has the advantages of high performance, low power consumption, and small size, making it an ideal choice for embedded applications.


In terms of industry trends, the XC2VP50-7FF1517C is expected to be widely used in the future, especially in the fields of industrial automation, medical devices, and consumer electronics. Its high integration capabilities and low power consumption make it an ideal choice for these applications. In addition, its small size makes it suitable for applications where space is limited.


In terms of future development, the XC2VP50-7FF1517C is expected to be used in the development and popularization of intelligent robots. Its high-performance and low-power consumption capabilities make it suitable for complex tasks such as facial recognition, path planning, and motion control. In order to use the chip model effectively, the application environment needs to support new technologies such as artificial intelligence, deep learning, and machine learning. Technical talents such as software engineers, hardware engineers, and data scientists are needed to develop and implement these technologies.


Overall, the chip model XC2VP50-7FF1517C is an ideal choice for embedded applications due to its high performance, low power consumption, and small size. It is expected to be widely used in the future, especially in the fields of industrial automation, medical devices, and consumer electronics. In addition, it can also be used in the development and popularization of intelligent robots, and the application environment needs to support new technologies such as artificial intelligence, deep learning, and machine learning.



3,958 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote