AMD Xilinx
XC2VP50-7FF1152I
XC2VP50-7FF1152I ECAD Model
XC2VP50-7FF1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 692 | |
| Number of Outputs | 644 | |
| Number of Logic Cells | 53136 | |
| Number of CLBs | 5904 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5904 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP50-7FF1152I Datasheet Download
XC2VP50-7FF1152I Overview
The chip model XC2VP50-7FF1152I is a model of field programmable gate array (FPGA) chip developed by Xilinx Corporation. It is characterized by its high integration and low power consumption, and its compact size makes it suitable for a variety of applications. As a result, it has become a popular choice for the development of advanced communication systems, intelligent robots, and other embedded systems.
In terms of industry trends, the XC2VP50-7FF1152I model is expected to be widely used in the future, and its applications are expected to expand. With the development of new technologies, the model is expected to be upgraded and improved in order to meet the needs of the application environment. Furthermore, new technologies such as artificial intelligence, machine learning, and deep learning are likely to be adopted in order to support the development and popularization of future intelligent robots.
In terms of the original design intention of the XC2VP50-7FF1152I model, it was designed to provide users with a low-cost and low-power solution for embedded systems. It is also designed to be flexible and customizable, allowing users to tailor the model to their specific needs. As a result, the model is expected to be applicable to a wide range of applications, from consumer electronics to industrial automation.
In terms of the technical talents needed to use the XC2VP50-7FF1152I model effectively, a basic understanding of FPGA technology is required. In addition, a good understanding of embedded systems, digital signal processing, and computer architecture is also necessary. Furthermore, knowledge of programming languages such as Verilog and VHDL is also required in order to effectively utilize the model.
In conclusion, the XC2VP50-7FF1152I model is an advanced FPGA chip that is expected to be widely used in the future. Its application is expected to expand with the development of new technologies, and it is expected to be applicable to a wide range of applications. Furthermore, technical talents such as a basic understanding of FPGA technology and a good understanding of embedded systems, digital signal processing, and computer architecture are necessary in order to use the model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||