AMD Xilinx
XC2VP50-7FF1148C
XC2VP50-7FF1148C ECAD Model
XC2VP50-7FF1148C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 812 | |
| Number of Outputs | 812 | |
| Number of Logic Cells | 53136 | |
| Number of CLBs | 5904 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5904 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1148 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1148 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1148,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1148,34X34,40 | |
| Pin Count | 1148 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
XC2VP50-7FF1148C Datasheet Download
XC2VP50-7FF1148C Overview
The XC2VP50-7FF1148C chip model is an advanced integrated circuit developed by Xilinx Company, which is suitable for high-performance digital signal processing, embedded processing, image processing, etc. It requires the use of HDL language. This chip model is designed with a specific purpose in mind, and its features and capabilities can be upgraded in the future.
The XC2VP50-7FF1148C chip model has the potential to be applied to advanced communication systems. It has the ability to process and transmit data quickly and accurately, making it suitable for a variety of communication applications. This chip model is also capable of handling large amounts of data, which makes it ideal for use in wireless networks and other complex communication systems.
The XC2VP50-7FF1148C chip model can also be used in the development and popularization of future intelligent robots. It is capable of performing complex calculations and making decisions based on input data. This chip model is also capable of recognizing patterns and objects, which makes it suitable for use in robotic applications. To use this model effectively, it is necessary to have a strong understanding of HDL language and a good knowledge of robotics.
Overall, the XC2VP50-7FF1148C chip model is a powerful and versatile integrated circuit that can be applied to a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, advanced communication systems, and the development and popularization of future intelligent robots. To use this model effectively, it is necessary to have a strong understanding of HDL language and a good knowledge of robotics.
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