
AMD Xilinx
XC2VP50-6FFG1517I
XC2VP50-6FFG1517I ECAD Model
XC2VP50-6FFG1517I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 852 | |
Number of Outputs | 852 | |
Number of Logic Cells | 53136 | |
Number of CLBs | 5904 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5904 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1517,39X39,40 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.7.A |
XC2VP50-6FFG1517I Datasheet Download
XC2VP50-6FFG1517I Overview
The chip model XC2VP50-6FFG1517I is a cutting-edge chip solution designed to meet the growing demands of the industry. Developed by Xilinx, the XC2VP50-6FFG1517I is a Field Programmable Gate Array (FPGA) that provides a high-performance computing platform. This chip model is designed to be flexible and customizable, allowing users to tailor the chip to their specific needs.
Xilinx has designed the XC2VP50-6FFG1517I to provide a significant performance boost over previous FPGA models. With its increased processing power, the chip model is capable of handling complex tasks faster and more efficiently than ever before. This makes it ideal for applications such as artificial intelligence, machine learning, and data analytics. Additionally, the XC2VP50-6FFG1517I is designed to be energy efficient, consuming less power than other FPGA solutions.
The XC2VP50-6FFG1517I has several advantages that make it an attractive option for industry professionals. Its high-performance computing capabilities and energy efficiency make it ideal for applications that require a lot of processing power. Additionally, its flexibility and customization allow users to tailor the chip to their specific needs. This makes it a great choice for applications in a wide range of industries, from automotive to aerospace.
As the demand for the XC2VP50-6FFG1517I increases, it is important to consider the potential applications of the chip. While the chip is designed to be flexible and customizable, it may require the support of new technologies to meet the specific needs of an application. As such, it is important to consider the specific design requirements of the chip when determining whether the application environment requires the support of new technologies.
When designing the XC2VP50-6FFG1517I, there are several factors to consider. For example, the chip must be designed with the appropriate voltage and frequency requirements for the application. Additionally, the chip must be designed with the appropriate number of logic blocks and memory blocks for the application. It is also important to consider the specific timing requirements of the application, as this will determine the amount of time the chip requires to complete its tasks.
Finally, it is important to consider any potential risks associated with the XC2VP50-6FFG1517I. For example, the chip must be designed with the appropriate safeguards to protect against potential hardware or software failures. Additionally, the chip must be designed to be compatible with the specific application environment. By taking these precautions, the XC2VP50-6FFG1517I can be used safely and effectively in a wide range of applications.
In conclusion, the XC2VP50-6FFG1517I is a powerful and efficient chip solution designed to meet the growing demands of the industry. With its increased processing power, flexibility, and customization, the chip is a great choice for a wide range of applications. However, it is important to consider the specific design requirements of the chip when determining whether the application environment requires the support of new technologies. By taking the necessary precautions and designing the chip appropriately, the XC2VP50-6FFG1517I can be used safely and effectively in a wide range of applications.
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