XC2VP50-6FFG1517I
XC2VP50-6FFG1517I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC2VP50-6FFG1517I


XC2VP50-6FFG1517I
F20-XC2VP50-6FFG1517I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XC2VP50-6FFG1517I ECAD Model


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XC2VP50-6FFG1517I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 852
Number of Outputs 852
Number of Logic Cells 53136
Number of CLBs 5904
Combinatorial Delay of a CLB-Max 320 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 5904 CLBS
Clock Frequency-Max 1.2 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA1517,39X39,40
Pin Count 1517
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.7.A

XC2VP50-6FFG1517I Datasheet Download


XC2VP50-6FFG1517I Overview



The chip model XC2VP50-6FFG1517I is a cutting-edge chip solution designed to meet the growing demands of the industry. Developed by Xilinx, the XC2VP50-6FFG1517I is a Field Programmable Gate Array (FPGA) that provides a high-performance computing platform. This chip model is designed to be flexible and customizable, allowing users to tailor the chip to their specific needs.


Xilinx has designed the XC2VP50-6FFG1517I to provide a significant performance boost over previous FPGA models. With its increased processing power, the chip model is capable of handling complex tasks faster and more efficiently than ever before. This makes it ideal for applications such as artificial intelligence, machine learning, and data analytics. Additionally, the XC2VP50-6FFG1517I is designed to be energy efficient, consuming less power than other FPGA solutions.


The XC2VP50-6FFG1517I has several advantages that make it an attractive option for industry professionals. Its high-performance computing capabilities and energy efficiency make it ideal for applications that require a lot of processing power. Additionally, its flexibility and customization allow users to tailor the chip to their specific needs. This makes it a great choice for applications in a wide range of industries, from automotive to aerospace.


As the demand for the XC2VP50-6FFG1517I increases, it is important to consider the potential applications of the chip. While the chip is designed to be flexible and customizable, it may require the support of new technologies to meet the specific needs of an application. As such, it is important to consider the specific design requirements of the chip when determining whether the application environment requires the support of new technologies.


When designing the XC2VP50-6FFG1517I, there are several factors to consider. For example, the chip must be designed with the appropriate voltage and frequency requirements for the application. Additionally, the chip must be designed with the appropriate number of logic blocks and memory blocks for the application. It is also important to consider the specific timing requirements of the application, as this will determine the amount of time the chip requires to complete its tasks.


Finally, it is important to consider any potential risks associated with the XC2VP50-6FFG1517I. For example, the chip must be designed with the appropriate safeguards to protect against potential hardware or software failures. Additionally, the chip must be designed to be compatible with the specific application environment. By taking these precautions, the XC2VP50-6FFG1517I can be used safely and effectively in a wide range of applications.


In conclusion, the XC2VP50-6FFG1517I is a powerful and efficient chip solution designed to meet the growing demands of the industry. With its increased processing power, flexibility, and customization, the chip is a great choice for a wide range of applications. However, it is important to consider the specific design requirements of the chip when determining whether the application environment requires the support of new technologies. By taking the necessary precautions and designing the chip appropriately, the XC2VP50-6FFG1517I can be used safely and effectively in a wide range of applications.



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