AMD Xilinx
XC2VP50-6FFG1517C
XC2VP50-6FFG1517C ECAD Model
XC2VP50-6FFG1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 852 | |
| Number of Outputs | 852 | |
| Number of Logic Cells | 53136 | |
| Number of CLBs | 5904 | |
| Combinatorial Delay of a CLB-Max | 320 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5904 CLBS | |
| Clock Frequency-Max | 1.2 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2VP50-6FFG1517C Datasheet Download
XC2VP50-6FFG1517C Overview
The XC2VP50-6FFG1517C chip model is a cutting-edge technology developed by Xilinx, Inc. to meet the ever-growing demand for high-performance computing solutions. It is a Field Programmable Gate Array (FPGA) that can be used in a variety of applications, such as embedded systems, automotive systems, industrial automation, and communications. The chip model is based on the Virtex-II Pro and Spartan-3E FPGA architectures and has a range of features and capabilities.
The XC2VP50-6FFG1517C chip model is designed to provide high-speed performance and reliable operation. It has a maximum clock speed of 250 MHz and a maximum power consumption of 7.5 W. It also features a wide range of I/O, including LVDS, LVCMOS, and differential I/O. The chip model is also designed with advanced power management, which allows it to operate efficiently and with minimal power consumption.
The XC2VP50-6FFG1517C chip model has been designed to meet the needs of a variety of industries. It is suitable for use in embedded systems, automotive systems, industrial automation, and communications, as well as other applications. The chip model is also designed to be compatible with a range of software and hardware platforms, which makes it a versatile solution for a wide range of applications.
The XC2VP50-6FFG1517C chip model is expected to be in high demand in the future. It is a cutting-edge technology and is designed to meet the needs of a variety of industries. It has a wide range of features and capabilities and is designed to be compatible with a range of software and hardware platforms. As such, it is expected to be a popular choice for many applications in the future.
In terms of the application environment, the XC2VP50-6FFG1517C chip model may require the support of new technologies to ensure optimal performance. It is important to consider the specific design requirements of a particular application before selecting the chip model. It is also important to consider any potential compatibility issues with existing hardware and software platforms.
In conclusion, the XC2VP50-6FFG1517C chip model is a cutting-edge technology developed by Xilinx, Inc. to meet the ever-growing demand for high-performance computing solutions. It is a Field Programmable Gate Array (FPGA) that can be used in a variety of applications, such as embedded systems, automotive systems, industrial automation, and communications. The chip model is designed to provide high-speed performance and reliable operation, and is expected to be in high demand in the future. When selecting the chip model for a particular application, it is important to consider the specific design requirements of the application, as well as any potential compatibility issues with existing hardware and software platforms.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||