XC2VP50-6FFG1152C

The XC2VP50-6FFG1152C is a FPGA chip from Xilinx Corporation, a leading provider of field-programmable gate arrays (FPGAs). It is a 6-layer device with a total of 11,520 logic cells, making it suitable for a variety of applications. The chip is built on a Virtex-II Pro platform and has a 6-layer copper interconnect structure. It has a maximum operating frequency of 200 MHz and a maximum power consumption of 2.5W.

The XC2VP50-6FFG1152C is designed for high-performance applications and offers a range of features and benefits. It has a large number of I/O pins, including 144 differential I/O pairs, up to 576 single-ended I/O pins and up to 64 dedicated clock pins. It also features a high-speed RocketIO transceiver for high-speed data transmission. The chip includes a range of memory blocks, including up to 8 Mbits of distributed RAM, up to 4 Mbits of distributed ROM, up to 4 Mbits of distributed FIFO, and up to 8 Mbits of distributed register files.

The XC2VP50-6FFG1152C is suitable for a wide range of applications, including high-performance digital signal processing (DSP) systems, embedded systems, communications systems, and network applications. It can be used to create a wide range of custom logic designs, including digital signal processing (DSP) systems, embedded systems, communications systems, and network applications. It is also suitable for use in a variety of industrial and automotive applications. The chip is available in a variety of packages, including a BGA package with a 0.8mm pitch.