AMD Xilinx
XC2VP50-5FFG1517I
XC2VP50-5FFG1517I ECAD Model
XC2VP50-5FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 852 | |
| Number of Outputs | 852 | |
| Number of Logic Cells | 53136 | |
| Number of CLBs | 5904 | |
| Combinatorial Delay of a CLB-Max | 360 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5904 CLBS | |
| Clock Frequency-Max | 1.05 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2VP50-5FFG1517I Datasheet Download
XC2VP50-5FFG1517I Overview
Chip model XC2VP50-5FFG1517I is a cutting-edge chip that has been designed to meet the ever-growing demands of modern networks. It is a high-performance chip that is designed to support the latest technologies and applications, making it an ideal choice for those looking to stay ahead of the curve.
As the world moves into an increasingly digital age, the need for reliable and powerful chips is becoming more important than ever. With the XC2VP50-5FFG1517I, users can rest assured that their networks will be able to keep up with the latest technology trends. The chip is designed to support the latest technologies, such as 5G, AI, and IoT, allowing users to stay ahead of the competition.
The XC2VP50-5FFG1517I is also designed to be used in a variety of intelligent scenarios. It can be used to power autonomous vehicles, smart homes, and other intelligent systems. It is also capable of supporting the latest technologies, such as facial recognition and voice recognition, making it an ideal choice for those looking to stay ahead of the competition.
In terms of product description and design, the XC2VP50-5FFG1517I is a high-performance chip that is designed to meet the demands of modern networks. It is designed to provide users with the highest levels of performance and reliability. The chip is also designed to be compatible with a variety of operating systems, making it an ideal choice for those who need a reliable and powerful chip for their network.
The XC2VP50-5FFG1517I has been put through rigorous testing, and there are a number of case studies available to demonstrate its effectiveness. The chip is designed to provide users with the highest levels of performance and reliability, and it has been proven to be capable of meeting the demands of modern networks.
When using the XC2VP50-5FFG1517I, there are a few precautions that should be taken. It is important to ensure that the chip is properly installed, and that it is compatible with the network and operating system. Additionally, it is important to ensure that the chip is properly maintained, as it can become damaged if not properly cared for.
In conclusion, the XC2VP50-5FFG1517I is a cutting-edge chip that has been designed to meet the ever-growing demands of modern networks. It is designed to support the latest technologies, such as 5G, AI, and IoT, allowing users to stay ahead of the competition. It is also capable of being used in a variety of intelligent scenarios, and it has been put through rigorous testing, with a number of case studies available to demonstrate its effectiveness. However, it is important to ensure that the chip is properly installed, and that it is compatible with the network and operating system, as well as properly maintained.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||