AMD Xilinx
XC2VP40-7FFG1152I
XC2VP40-7FFG1152I ECAD Model
XC2VP40-7FFG1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 4848 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4848 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP40-7FFG1152I Datasheet Download
XC2VP40-7FFG1152I Overview
The chip model XC2VP40-7FFG1152I is a new and advanced chip model that has been developed to meet the needs of the ever-changing industry trends. It is a powerful, low-power, high-performance FPGA chip model that is capable of supporting a wide range of applications. It is designed to be highly efficient and reliable, and it is capable of providing the best performance for any given application.
The chip model XC2VP40-7FFG1152I is designed to be able to support advanced communication systems, and it is capable of providing the highest level of performance for any given application. It is designed to be able to support the latest technologies, including high-speed data transfer, high-speed networking, and advanced security protocols. It is also capable of supporting a wide range of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing.
The chip model XC2VP40-7FFG1152I is capable of being upgraded in the future, and it is designed to be able to support the latest technologies and applications. It is also capable of being used in the era of fully intelligent systems, and it is capable of being used in a wide range of networks and intelligent scenarios. It is also capable of providing the highest level of performance for any given application.
Overall, the chip model XC2VP40-7FFG1152I is a powerful, low-power, high-performance FPGA chip model that is designed to be highly efficient and reliable. It is capable of supporting the latest technologies and applications, and it is capable of being used in a wide range of networks and intelligent scenarios. It is also capable of being upgraded in the future, and it is capable of being used in the era of fully intelligent systems.
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1,615 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||