XC2VP40-7FF1152I
XC2VP40-7FF1152I
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rohs

AMD Xilinx

XC2VP40-7FF1152I


XC2VP40-7FF1152I
F20-XC2VP40-7FF1152I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1 MM PITCH, FLIP CHIP, FBGA-1152
1 MM PITCH, FLIP CHIP, FBGA-1152

XC2VP40-7FF1152I ECAD Model


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XC2VP40-7FF1152I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 692
Number of Outputs 644
Number of Logic Cells 43632
Number of CLBs 4848
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 4848 CLBS
Clock Frequency-Max 1.35 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1 MM PITCH, FLIP CHIP, FBGA-1152
Pin Count 1152
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP40-7FF1152I Datasheet Download


XC2VP40-7FF1152I Overview



The XC2VP40-7FF1152I chip model is a powerful processor designed to meet the needs of advanced communication systems. It is a highly integrated chip model, capable of providing excellent performance and scalability. It is also a very cost-effective solution, providing users with a great value for their money.


The XC2VP40-7FF1152I chip model has several advantages, such as its low power consumption, high speed, and low latency. It also offers a variety of features, such as multiple cores, multiple threads, and support for various communication protocols. This makes it an ideal choice for use in communication systems.


The XC2VP40-7FF1152I chip model is expected to have a growing demand in the future. This is due to the increasing need for advanced communication systems, as well as the need for more cost-effective solutions. As the demand for advanced communication systems increases, the demand for the XC2VP40-7FF1152I chip model is also expected to increase.


The original design intention of the XC2VP40-7FF1152I chip model was to provide a powerful and reliable processor for advanced communication systems. It was designed to be cost-effective, yet provide excellent performance. The chip model is also designed to be upgradable, allowing users to upgrade their systems as their needs evolve. This makes the chip model a great choice for those who want to keep their systems up-to-date.


The XC2VP40-7FF1152I chip model can be used in a variety of networks, including wireless networks, cellular networks, and the Internet of Things (IoT). It can also be used in intelligent scenarios, such as machine learning, autonomous vehicles, and smart home systems. This makes it a great choice for those who want to stay ahead of the curve when it comes to technology.


The XC2VP40-7FF1152I chip model is also suitable for use in the era of fully intelligent systems. It can be used for various tasks, such as data processing, analytics, and machine learning. This makes it a great choice for those who want to take advantage of the latest technology and stay ahead of the competition.


In conclusion, the XC2VP40-7FF1152I chip model is an excellent choice for those who need a cost-effective and powerful processor for advanced communication systems. It is expected to have a growing demand in the future, and can be used in a variety of networks and intelligent scenarios. Its upgradability makes it a great choice for those who want to stay ahead of the curve when it comes to technology.



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