
AMD Xilinx
XC2VP40-6FFG1148I
XC2VP40-6FFG1148I ECAD Model
XC2VP40-6FFG1148I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 804 | |
Number of Outputs | 804 | |
Number of Logic Cells | 43632 | |
Number of CLBs | 4848 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4848 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1148 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1148 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1148,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1148,34X34,40 | |
Pin Count | 1148 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2VP40-6FFG1148I Datasheet Download
XC2VP40-6FFG1148I Overview
The chip model XC2VP40-6FFG1148I is a powerful and versatile model that is used in many industries today. It is a field programmable gate array (FPGA) that is designed to be used in a wide range of applications. This model is capable of executing complex tasks and is used in many industries such as automotive, aerospace, and consumer electronics.
The XC2VP40-6FFG1148I is a highly advanced model that is capable of supporting a wide range of technologies. It is designed to be used in a wide range of applications, from industrial applications to consumer applications. It is capable of supporting a wide range of technologies such as high-speed signal processing, digital signal processing, and high-speed data transmission. It is also capable of supporting a wide range of communication protocols such as Ethernet, USB, and Wi-Fi.
The industry trends of the chip model XC2VP40-6FFG1148I are constantly changing and evolving. As technology advances, the XC2VP40-6FFG1148I is being used in more and more applications. The future development of related industries will depend on what specific technologies are needed. It is important to understand the product description and specific design requirements of the chip model XC2VP40-6FFG1148I, as well as the actual case studies and precautions that are necessary for its successful application.
In terms of whether the chip model XC2VP40-6FFG1148I can be applied to the development and popularization of future intelligent robots, the answer is yes. This model is capable of supporting a wide range of technologies, including those needed for the development of intelligent robots. It is also capable of supporting a wide range of communication protocols, making it ideal for the development of robot applications. However, it is important to note that the successful application of the XC2VP40-6FFG1148I requires the right technical talents. It is important to understand the product description and specific design requirements of the chip model, as well as the actual case studies and precautions that are necessary for its successful application.
In conclusion, the chip model XC2VP40-6FFG1148I is a powerful and versatile model that is used in many industries today. It is capable of supporting a wide range of technologies, making it ideal for the development and popularization of future intelligent robots. However, it is important to understand the product description and specific design requirements of the chip model, as well as the actual case studies and precautions that are necessary for its successful application.
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