AMD Xilinx
XC2VP40-6FF1517I
XC2VP40-6FF1517I ECAD Model
XC2VP40-6FF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 43632 | |
| Number of CLBs | 4848 | |
| Combinatorial Delay of a CLB-Max | 330 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4848 CLBS | |
| Clock Frequency-Max | 1.2 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP40-6FF1517I Datasheet Download
XC2VP40-6FF1517I Overview
The XC2VP40-6FF1517I chip model is a high-performance, low-cost integrated circuit (IC) designed to facilitate the development of advanced communication systems. This model is part of the Xilinx Virtex-II Pro family, and it features a low-power, high-speed system-on-chip (SoC) architecture. It is designed to meet the needs of today's high-speed, high-volume communication systems.
The XC2VP40-6FF1517I chip model has several advantages. It is a low-cost solution that can be used in a variety of applications, from high-end communication systems to low-end consumer electronics. It is also highly reliable, with a low failure rate, and it consumes less power than other ICs. It also has a high-speed system-on-chip architecture that allows for faster data processing.
The demand for the XC2VP40-6FF1517I chip model is expected to increase in the future as more advanced communication systems are developed. As the technology continues to evolve, this model will be able to support the latest communication protocols and standards. It is also expected to become even more cost-effective, making it an attractive option for businesses and consumers alike.
The original design intention of the XC2VP40-6FF1517I chip model was to provide a low-cost, low-power solution for advanced communication systems. It is also capable of being upgraded to support new communication protocols and standards. This makes it a great choice for businesses and individuals looking to upgrade their communication systems.
The XC2VP40-6FF1517I chip model can also be applied to the development and popularization of future intelligent robots. This model is well-suited to meet the needs of robots, as it is a low-cost, low-power solution that can be upgraded to support new communication protocols and standards. To use the model effectively, technical talents such as software engineers and roboticists are needed.
In conclusion, the XC2VP40-6FF1517I chip model is a low-cost, low-power integrated circuit that is ideal for advanced communication systems. It is expected to become even more cost-effective in the future, making it an attractive option for businesses and consumers. It can also be used in the development and popularization of future intelligent robots, although technical talents are needed to use the model effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||