AMD Xilinx
XC2VP4-7FGG256I
XC2VP4-7FGG256I ECAD Model
XC2VP4-7FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 752 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 752 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP4-7FGG256I Datasheet Download
XC2VP4-7FGG256I Overview
The XC2VP4-7FGG256I chip model is a cutting-edge technology that has been developed to meet the demands of today’s high-speed data processing needs. It is a high-performance, low-power, and low-cost integrated circuit that has been designed to be used in a variety of applications. This chip model is capable of providing a wide range of features such as high-speed data processing, low-latency response time, and high-efficiency power consumption.
In terms of industry trends, the XC2VP4-7FGG256I is expected to be used in a variety of applications such as networking, storage, and communications. It is also expected to be used in the development of new technologies such as 5G, artificial intelligence (AI), and the Internet of Things (IoT). The chip model is expected to be a key component in the development of these technologies and will be used to enable new applications and services.
In terms of future development, the XC2VP4-7FGG256I chip model is expected to be upgraded in order to meet the demands of future applications. It is also expected to be used in advanced communication systems such as 5G networks, AI-enabled robots, and autonomous vehicles. The chip model is expected to be used in networks to enable intelligent scenarios such as facial recognition, autonomous navigation, and natural language processing.
The XC2VP4-7FGG256I chip model is expected to play an important role in the development of fully intelligent systems in the future. It is expected to be used in a variety of applications such as AI-enabled robots, autonomous vehicles, and 5G networks. The chip model is expected to be used to enable new applications and services as well as to provide enhanced performance and improved power efficiency.
Overall, the XC2VP4-7FGG256I chip model is a cutting-edge technology that has been designed to meet the demands of today’s high-speed data processing needs. It is expected to be used in a variety of applications such as networking, storage, and communications. In the future, the chip model is expected to be upgraded in order to meet the demands of future applications and be used in advanced communication systems such as 5G networks, AI-enabled robots, and autonomous vehicles. It is also expected to be used in the development of fully intelligent systems in order to enable new applications and services as well as to provide enhanced performance and improved power efficiency.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||