AMD Xilinx
XC2VP4-7FFG672C
XC2VP4-7FFG672C ECAD Model
XC2VP4-7FFG672C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 348 | |
| Number of Outputs | 348 | |
| Number of Logic Cells | 6768 | |
| Number of CLBs | 752 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 752 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA672,26X26,40 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2VP4-7FFG672C Datasheet Download
XC2VP4-7FFG672C Overview
The XC2VP4-7FFG672C chip model is a powerful digital signal processor, embedded processor, and image processor, which is suitable for high-performance applications. It requires the use of HDL language to program and operate. With the rapid development of modern technology and the continuous advancement of artificial intelligence, the application scenarios of the XC2VP4-7FFG672C chip model have become more and more extensive.
In terms of networks, the chip is suitable for the development of network communication systems such as routers and switches, and can be used to build a variety of network protocols. In addition, it can be used in intelligent scenarios such as automatic driving, natural language processing, and facial recognition. It is also possible to apply this chip model to the development and popularization of future intelligent robots. The chip model is also suitable for the era of fully intelligent systems, providing a stable and reliable platform for intelligent operations.
In order to use the XC2VP4-7FFG672C chip model effectively, technical talents such as electrical engineers, computer scientists, and software engineers are needed. Electrical engineers are responsible for the design and implementation of the hardware architecture, while computer scientists and software engineers are responsible for the development of the software and algorithms. All these professionals need to have a deep understanding of the chip model, as well as the HDL language, to ensure the successful implementation of the application scenarios.
In conclusion, the XC2VP4-7FFG672C chip model is a powerful and reliable processor, which is suitable for a variety of applications such as high-performance digital signal processing, embedded processing, image processing, network communication, and intelligent scenarios. It is also suitable for the development and popularization of future intelligent robots and can be used in the era of fully intelligent systems. To use the chip model effectively, technical talents such as electrical engineers, computer scientists, and software engineers are needed.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||