AMD Xilinx
XC2VP30-7FGG676C
XC2VP30-7FGG676C ECAD Model
XC2VP30-7FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 30816 | |
| Number of CLBs | 3424 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3424 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA676,26X26,40 | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2VP30-7FGG676C Datasheet Download
XC2VP30-7FGG676C Overview
The XC2VP30-7FGG676C chip model is a high-performance digital signal processor designed for embedded processing, image processing and other applications. It is designed to be used with HDL (Hardware Description Language) to make it easier to program and create complex digital designs. This chip model is a testament to the ever-evolving technology of the digital world, and it is sure to be a powerful tool in the hands of developers.
The future of the XC2VP30-7FGG676C chip model is bright and full of potential. It is sure to be used in many different applications, as the digital world continues to grow and evolve. It can be used in networks, intelligent scenarios, and even in the era of fully intelligent systems. This chip model is capable of handling complex tasks, and is sure to be a valuable asset to any project.
The XC2VP30-7FGG676C chip model is also sure to benefit from the ever-evolving technologies of the digital world. It is likely to be used in conjunction with new technologies, such as artificial intelligence, machine learning, and blockchain. These technologies are sure to revolutionize the way we interact with computers, and the XC2VP30-7FGG676C chip model is sure to be at the forefront of this revolution.
The XC2VP30-7FGG676C chip model is a powerful tool in the hands of developers and is sure to be a valuable asset in the ever-evolving digital world. It is capable of handling complex tasks and is sure to benefit from the ever-evolving technologies of the digital world. It is likely to be used in networks, intelligent scenarios, and even in the era of fully intelligent systems. With its powerful capabilities, the XC2VP30-7FGG676C chip model is sure to be a valuable asset to any project.
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4,634 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $940.4160 | $940.4160 |
| 10+ | $930.3040 | $9,303.0400 |
| 100+ | $879.7440 | $87,974.4000 |
| 1000+ | $829.1840 | $414,592.0000 |
| 10000+ | $758.4000 | $758,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||