AMD Xilinx
XC2VP30-7FG676C
XC2VP30-7FG676C ECAD Model
XC2VP30-7FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 30816 | |
| Number of CLBs | 3424 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3424 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA676,26X26,40 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2VP30-7FG676C Datasheet Download
XC2VP30-7FG676C Overview
The XC2VP30-7FG676C chip model is a powerful, versatile and reliable solution for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to meet the needs of modern industrial applications, such as automotive, aerospace, and medical. The chip model is capable of handling complex tasks and providing accurate results.
The XC2VP30-7FG676C chip model is based on the latest Xilinx Virtex-II Pro FPGA technology, offering a wide range of features and capabilities. The chip model is designed to be compatible with the industry-standard HDL language, allowing for easier integration into existing systems. Additionally, the chip model is designed to be energy efficient, providing a cost-effective solution for high-performance applications.
The XC2VP30-7FG676C chip model is an ideal choice for applications that require high-speed, low-power operation. The chip model is also well-suited for applications that require reliable data processing and communication. Additionally, the chip model is designed to be compatible with a variety of industry-standard software and hardware platforms, making it easy to integrate into existing systems.
The XC2VP30-7FG676C chip model is expected to be in high demand in the future, as more applications require its high-performance capabilities. As the technology continues to become more advanced, the chip model is likely to be adopted by more industries, such as automotive, aerospace, and medical. Additionally, the chip model is expected to be used in applications that require the support of new technologies, such as artificial intelligence, machine learning, and the Internet of Things.
In conclusion, the XC2VP30-7FG676C chip model is a powerful and reliable solution for high-performance applications. It is designed to be compatible with the industry-standard HDL language, making it easy to integrate into existing systems. Additionally, the chip model is energy efficient and cost-effective, making it an ideal choice for applications that require high-speed, low-power operation. The chip model is expected to be in high demand in the future, as more applications require its high-performance capabilities.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||