XC2VP30-7FF1152I
XC2VP30-7FF1152I
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rohs

AMD Xilinx

XC2VP30-7FF1152I


XC2VP30-7FF1152I
F20-XC2VP30-7FF1152I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1 MM PITCH, FLIP CHIP, FBGA-1152
1 MM PITCH, FLIP CHIP, FBGA-1152

XC2VP30-7FF1152I ECAD Model


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XC2VP30-7FF1152I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 644
Number of Outputs 644
Number of Logic Cells 30816
Number of CLBs 3424
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 3424 CLBS
Clock Frequency-Max 1.35 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1 MM PITCH, FLIP CHIP, FBGA-1152
Pin Count 1152
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP30-7FF1152I Datasheet Download


XC2VP30-7FF1152I Overview



The Xilinx XC2VP30-7FF1152I chip model is an advanced FPGA device that is designed to provide high-performance, low-power, and reliable solutions for a wide range of applications. It is a versatile and powerful device that can be used for a variety of tasks, from communications to robotics. The design intention of the XC2VP30-7FF1152I is to provide a reliable and efficient platform for high-performance applications.


The Xilinx XC2VP30-7FF1152I chip model is designed with the intention of providing a reliable and efficient platform for high-performance applications. It is a low-power device that supports multiple I/O and memory interfaces, as well as a wide range of logic and arithmetic operations. The device also includes a wide range of features such as a high-speed clock, programmable logic blocks, and multi-cycle operations. The device also supports a wide range of applications, ranging from communications to robotics.


The Xilinx XC2VP30-7FF1152I chip model is designed to be highly scalable and upgradeable. It is capable of supporting future upgrades and expansions, allowing users to customize their device to meet their specific needs. The device also supports a wide range of communication systems, including Wi-Fi, Bluetooth, Zigbee, and more.


When it comes to the application of the Xilinx XC2VP30-7FF1152I chip model to the development and popularization of future intelligent robots, the device is capable of providing a reliable and efficient platform for the development of robots. The device is capable of supporting a wide range of features, ranging from sensors to actuators, and can be used to develop a wide range of robotic applications. In order to use the device effectively, users will need to have a good understanding of the device's capabilities and features, as well as the necessary programming skills.


In conclusion, the Xilinx XC2VP30-7FF1152I chip model is a powerful and versatile device that is designed to provide reliable and efficient solutions for a wide range of applications. It is capable of supporting future upgrades and expansions, allowing users to customize their device to meet their specific needs. The device also supports a wide range of communication systems and can be used to develop and popularize future intelligent robots. In order to use the device effectively, users will need to have a good understanding of the device's capabilities and features, as well as the necessary programming skills.



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