XC2VP30-6FGG676I
XC2VP30-6FGG676I
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rohs

AMD Xilinx

XC2VP30-6FGG676I


XC2VP30-6FGG676I
F20-XC2VP30-6FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA676,26X26,40
BGA, BGA676,26X26,40

XC2VP30-6FGG676I ECAD Model


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XC2VP30-6FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 416
Number of Outputs 416
Number of Logic Cells 30816
Number of CLBs 3424
Combinatorial Delay of a CLB-Max 320 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 3424 CLBS
Clock Frequency-Max 1.2 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA676,26X26,40
Pin Count 676
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2VP30-6FGG676I Datasheet Download


XC2VP30-6FGG676I Overview



The XC2VP30-6FGG676I chip model is a powerful and versatile tool that can be used to create advanced communication systems. It is designed with the intention of providing a reliable and cost-effective solution for a variety of applications. The chip model has a wide range of features that make it suitable for a wide array of applications, including high-speed communication, data processing, and signal processing.


The XC2VP30-6FGG676I chip model is based on the latest technology and is designed to meet a variety of requirements. It is equipped with a high-performance processor and a large memory capacity, making it suitable for a wide range of applications. The chip model also has a wide range of interfaces, allowing it to be easily integrated into existing systems.


The chip model has a number of advantages, including a low power consumption and a small form factor. It is also designed to be compatible with a wide range of operating systems, making it suitable for a variety of applications. In addition, the chip model is designed to be easily upgradable, allowing it to keep up with the latest technology.


In terms of industry trends, the XC2VP30-6FGG676I chip model is expected to remain a popular choice for a variety of applications. It is likely to remain a reliable and cost-effective solution for a variety of applications, as well as being a suitable choice for advanced communication systems.


When using the XC2VP30-6FGG676I chip model, it is important to consider the specific requirements of the application. It is also important to consider any additional technologies that may be required to support the application. It is also important to consider any potential issues that may arise when using the chip model, such as compatibility issues and power consumption.


Finally, it is important to consider the product description and design requirements of the XC2VP30-6FGG676I chip model, as well as any case studies and precautions that may be required. By considering these factors, it is possible to ensure that the chip model is suitable for the application and that it is able to meet the requirements of the application.



2,896 In Stock


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Unit Price: $1,011.20
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $940.4160 $940.4160
10+ $930.3040 $9,303.0400
100+ $879.7440 $87,974.4000
1000+ $829.1840 $414,592.0000
10000+ $758.4000 $758,400.0000
The price is for reference only, please refer to the actual quotation!

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