
AMD Xilinx
XC2VP30-6FGG676I
XC2VP30-6FGG676I ECAD Model
XC2VP30-6FGG676I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 416 | |
Number of Outputs | 416 | |
Number of Logic Cells | 30816 | |
Number of CLBs | 3424 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3424 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA676,26X26,40 | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2VP30-6FGG676I Datasheet Download
XC2VP30-6FGG676I Overview
The XC2VP30-6FGG676I chip model is a powerful and versatile tool that can be used to create advanced communication systems. It is designed with the intention of providing a reliable and cost-effective solution for a variety of applications. The chip model has a wide range of features that make it suitable for a wide array of applications, including high-speed communication, data processing, and signal processing.
The XC2VP30-6FGG676I chip model is based on the latest technology and is designed to meet a variety of requirements. It is equipped with a high-performance processor and a large memory capacity, making it suitable for a wide range of applications. The chip model also has a wide range of interfaces, allowing it to be easily integrated into existing systems.
The chip model has a number of advantages, including a low power consumption and a small form factor. It is also designed to be compatible with a wide range of operating systems, making it suitable for a variety of applications. In addition, the chip model is designed to be easily upgradable, allowing it to keep up with the latest technology.
In terms of industry trends, the XC2VP30-6FGG676I chip model is expected to remain a popular choice for a variety of applications. It is likely to remain a reliable and cost-effective solution for a variety of applications, as well as being a suitable choice for advanced communication systems.
When using the XC2VP30-6FGG676I chip model, it is important to consider the specific requirements of the application. It is also important to consider any additional technologies that may be required to support the application. It is also important to consider any potential issues that may arise when using the chip model, such as compatibility issues and power consumption.
Finally, it is important to consider the product description and design requirements of the XC2VP30-6FGG676I chip model, as well as any case studies and precautions that may be required. By considering these factors, it is possible to ensure that the chip model is suitable for the application and that it is able to meet the requirements of the application.
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2,896 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $940.4160 | $940.4160 |
10+ | $930.3040 | $9,303.0400 |
100+ | $879.7440 | $87,974.4000 |
1000+ | $829.1840 | $414,592.0000 |
10000+ | $758.4000 | $758,400.0000 |
The price is for reference only, please refer to the actual quotation! |