XC2VP30-6FG676I

The XC2VP30-6FG676I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. This chip is based on the Virtex II Pro architecture and is designed for high speed, high density applications. It has a total of 6 million logic gates and can be used to implement complex logic designs.

The chip has a total of 676 I/O pins, with up to 576 user I/O pins. It also has up to 4,096 Kbits of Block RAM and up to 5 MultiGigabit Transceivers. The chip operates at a maximum speed of up to 500MHz and can be used to implement designs with up to 54 million system gates.

The XC2VP30-6FG676I can be used in a wide variety of applications, ranging from high speed networking, video and image processing, to embedded systems and medical equipment. It is ideal for applications requiring high speed, high density, and low power consumption. The chip is also suitable for a variety of other applications, such as aerospace, defense, and automotive.

The chip is available in a range of packages, including a 676-pin FineLine BGA (Ball Grid Array) package, a 676-pin FineLine PQFP (Plastic Quad Flat Pack) package, and a 676-pin FineLine TQFP (Thin Quad Flat Pack) package. It is also available in a range of temperature grades, from 0°C to 85°C.

Overall, the XC2VP30-6FG676I is a high performance FPGA chip that can be used for a wide variety of applications. It is ideal for applications requiring high speed, high density, and low power consumption.