AMD Xilinx
XC2VP20-7FGG676I
XC2VP20-7FGG676I ECAD Model
XC2VP20-7FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 2320 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2320 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP20-7FGG676I Datasheet Download
XC2VP20-7FGG676I Overview
The chip model XC2VP20-7FGG676I is a powerful and versatile FPGA device manufactured by Xilinx, Inc. It is designed to provide high performance and flexibility for a wide range of applications. The device features a wide range of features including a high speed memory interface, high speed signal processing capabilities, and a low power consumption. Additionally, the device is capable of supporting various communication protocols and is suitable for a variety of applications.
The XC2VP20-7FGG676I chip model has many advantages that make it an attractive choice for many industries. The device is capable of delivering high performance and flexibility with a low power consumption. It is also capable of supporting multiple communication protocols, making it suitable for a variety of applications. Furthermore, the device is capable of handling large data sets with ease, making it an ideal choice for tasks such as data storage and analysis.
The demand for the XC2VP20-7FGG676I chip model is expected to increase in the future as more industries embrace the technology. The device is suitable for a variety of applications, including communication systems, data storage and analysis, and machine learning. Additionally, with the increasing demand for intelligent systems, the XC2VP20-7FGG676I chip model is expected to become increasingly popular.
The original design intention of the XC2VP20-7FGG676I chip model was to provide a high performance and flexible solution for a wide range of applications. The device is capable of supporting multiple communication protocols, making it suitable for a variety of applications. Additionally, the device is capable of handling large data sets with ease, making it an ideal choice for tasks such as data storage and analysis. The device also features low power consumption, making it an attractive choice for many industries.
The XC2VP20-7FGG676I chip model is capable of being upgraded in the future, allowing it to support more advanced communication systems. Additionally, the device is capable of being applied to networks and intelligent scenarios, making it suitable for a variety of applications. Furthermore, the device is capable of being used in the era of fully intelligent systems, allowing it to be used in a variety of scenarios.
In conclusion, the XC2VP20-7FGG676I chip model is a powerful and versatile device that is suitable for a variety of applications. The device is capable of delivering high performance and flexibility with a low power consumption. Additionally, the device is capable of supporting multiple communication protocols, making it suitable for a variety of applications. Furthermore, the device is capable of being upgraded in the future, allowing it to support more advanced communication systems. The device is also capable of being applied to networks and intelligent scenarios, making it suitable for a variety of applications. Finally, the device is capable of being used in the era of fully intelligent systems, allowing it to be used in a variety of scenarios.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||